Exposure apparatus, exposing method, device manufacturing method, program, and recording medium

ABSTRACT

An exposure apparatus that exposes a substrate by exposure light via liquid between an optical member and the substrate includes: a liquid immersion member that forms an immersion liquid space on an object and comprises first and second members, the first member disposed at at least a portion of surrounding of the optical member, the second member disposed at at least a portion of surrounding of an optical path of the exposure light below of the first member, being movable with respect to the first member and comprising a second upper surface and a second lower surface, the second upper surface being opposite to a first lower surface of the first member via a gap, the second lower surface being capable of being opposite to the object, the object being movable below the optical member; and a vibration isolator that suppresses vibration of the first member.

This is a Divisional of U.S. patent application Ser. No. 14/047,433filed Oct. 7, 2013, which claims priority based on Japanese PatentApplication No. 2012-227214, filed Oct. 12, 2012, and is anon-provisional application based on U.S. Patent Provisional ApplicationNo. 61/716,821, filed Oct. 22, 2012. The contents of all priorapplications are incorporated herein by reference in their entireties.

TECHNICAL FIELD

The present invention relates to an exposure apparatus, an exposingmethod, a device manufacturing method, a program, and a recordingmedium.

BACKGROUND ART

For example, in an exposure apparatus which is used in aphotolithographic process, as disclosed in Patent Document shown below,a liquid immersion exposure apparatus which exposes a substrate byexposure light via a liquid is known.

RELATED ART DOCUMENT Patent Document

[Patent Document 1] U.S. Pat. No. 7,864,292

SUMMARY Problems to be Solved by the Invention

In an exposure apparatus, if undesirable vibration occurs or a membermoves to an undesirable position, exposure failure may occur. As aresult, a defective device may be manufactured.

An object of an aspect of the present invention is to provide anexposure apparatus and an exposing method capable of suppressingoccurrence of exposure failure. Moreover, an object of another aspect ofthe present invention is to provide a device manufacturing method, aprogram, and a recording medium capable of suppressing occurrence of adefective device.

Means for Solving the Problem

According to a first aspect of the present invention, there is providedan exposure apparatus that exposes a substrate by exposure light vialiquid between an emitting surface of an optical member and thesubstrate, the exposure apparatus comprising: a liquid immersion memberconfigured to form an immersion liquid space on an object and comprisinga first member and a second member, the first member being disposed atat least a portion of surrounding of the optical member, the secondmember being disposed at at least a portion of surrounding of an opticalpath of the exposure light below of the first member, being movable withrespect to the first member and comprising a second upper surface and asecond lower surface, the second upper surface being opposite to a firstlower surface of the first member via a gap, the second lower surfacebeing capable of being opposite to the object, the object being movablebelow of the optical member; and a vibration isolator configured tosuppress a vibration of the first member.

According to a second aspect of the present invention, there is providedan exposure apparatus that exposes a substrate by exposure light vialiquid between an emitting surface of an optical member and thesubstrate, the exposure apparatus comprising: a liquid immersion memberconfigured to form an immersion liquid space on an object and comprisinga first member and a second member, the first member being disposed atat least a portion of surrounding of the optical member, the secondmember being disposed at at least a portion of surrounding of an opticalpath of the exposure light below of the first member, being movable withrespect to the first member and comprising a second upper surface and asecond lower surface, the second upper surface being opposite to a firstlower surface of the first member via a gap, the second lower surfacebeing capable of being opposite to the object, the object being movablebelow of the optical member; and a first driving apparatus configured tomove the first member so that a displacement of the first member withrespect to a reference member is suppressed.

According to a third aspect of the present invention, there is provideda device manufacturing method including: exposing the substrate by usingthe exposure apparatus according to the first or second aspect; anddeveloping the exposed substrate.

According to a fourth aspect of the present invention, there is providedan exposing method in which a substrate is exposed by exposure light vialiquid between an emitting surface of an optical member and thesubstrate, the exposing method including: forming a liquid immersionspace of the liquid on the substrate by using a liquid immersion memberthat includes a first member and a second member, the first member beingdisposed at at least a portion of surrounding of the optical member, thesecond member being disposed at at least a portion of surrounding of anoptical path of the exposure light below of the first member andcomprising a second upper surface and a second lower surface, the secondupper surface being opposite to a first lower surface of the firstmember via a gap, the second lower surface being capable of beingopposite to the substrate, the substrate being movable below of theoptical member; exposing the substrate via the liquid of the liquidimmersion space by the exposure light emitted from the emitting surface;moving the second member with respect to the first member in at least aportion of exposure of the substrate; and suppressing vibration of thefirst member by using a vibration isolator.

According to a fifth aspect of the present invention, there is providedan exposing method in which a substrate is exposed by exposure light vialiquid between an emitting surface of an optical member and thesubstrate, the exposing method including: forming a liquid immersionspace of the liquid on the substrate by using a liquid immersion memberthat includes a first member and a second member, the first member beingdisposed at at least a portion of surrounding of the optical member, thesecond member being disposed at at least a portion of surrounding of anoptical path of the exposure light below of the first member andcomprising a second upper surface and a second lower surface, the secondupper surface being opposite to a first lower surface of the firstmember via a gap, the second lower surface being capable of beingopposite to the substrate, the substrate being movable below of theoptical member; exposing the substrate via the liquid of the liquidimmersion space by the exposure light emitted from the emitting surface;and moving the second member with respect to the first member in atleast a portion of exposure of the substrate, and moving the firstmember by a first driving apparatus so that displacement of the firstmember with respect to the reference member is suppressed.

According to a sixth aspect of the present invention, there is provideda device manufacturing method including: exposing the substrate usingthe exposure method according to the fourth or fifth aspect; anddeveloping the exposed substrate.

According to a seventh aspect of the present invention, there isprovided a program which causes a computer to execute a control of anexposure apparatus exposing a substrate by exposure light via liquidbetween an emitting surface of an optical member and the substrate, theprogram performs: forming a liquid immersion space of the liquid on thesubstrate by using a liquid immersion member that includes a firstmember and a second member, the first member being disposed at at leasta portion of surrounding of the optical member, the second member beingdisposed at at least a portion of surrounding of an optical path of theexposure light below of the first member and comprising a second uppersurface and a second lower surface, the second upper surface beingopposite to a first lower surface of the first member via a gap, thesecond lower surface being capable of being opposite to the substrate,the substrate being movable below of the optical member; exposing thesubstrate via the liquid of the liquid immersion space by the exposurelight emitted from the emitting surface; moving the second member withrespect to the first member in at least a portion of exposure of thesubstrate; and suppressing vibration of the first member by using avibration isolator.

According to an eighth aspect of the present invention, there isprovided a program which causes a computer to execute a control of anexposure apparatus exposing a substrate by exposure light via liquidbetween an emitting surface of an optical member and the substrate, theprogram performs: forming a liquid immersion space of the liquid on thesubstrate by using a liquid immersion member that includes a firstmember and a second member, the first member being disposed at at leasta portion of surrounding of the optical member, the second member beingdisposed at at least a portion of surrounding of an optical path of theexposure light below of the first member and comprising a second uppersurface and a second lower surface, the second upper surface beingopposite to a first lower surface of the first member via a gap, thesecond lower surface being capable of being opposite to the substrate,the substrate being movable below of the optical member; exposing thesubstrate via the liquid of the liquid immersion space by the exposurelight emitted from the emitting surface; and moving the second memberwith respect to the first member in at least a portion of exposure ofthe substrate, and moving the first member by a first driving apparatusso that displacement of the first member with respect to the referencemember is suppressed.

According to a ninth aspect of the present invention, there is provideda computer-readable recording medium on which the program according tothe seventh or eighth aspect is recorded.

Advantage of the Invention

According to the aspects of the present invention, occurrence ofexposure failure can be suppressed. In addition, according to theaspects of the present invention, occurrence of a defective device canbe suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view showing an example of an exposure apparatus accordingto a first embodiment.

FIG. 2 is a side cross-sectional view showing an example of a liquidimmersion member according to the first embodiment.

FIG. 3 is a side cross-sectional view showing a portion of the liquidimmersion member according to the first embodiment.

FIG. 4 is a view showing an example of an operation of the liquidimmersion member according to the first embodiment.

FIG. 5 is a view when the liquid immersion member according to the firstembodiment is viewed from below.

FIG. 6 is an exploded perspective view showing an example of the liquidimmersion member according to the first embodiment.

FIG. 7 is an exploded perspective view showing an example of the liquidimmersion member according to the first embodiment.

FIG. 8 is a view showing an example of a first member according to thefirst embodiment.

FIG. 9 is a view for explaining an example of an operation of the liquidimmersion member according to the first embodiment.

FIG. 10 is a view showing an example of a supporting apparatus accordingto the first embodiment.

FIG. 11 is a view showing an example of the supporting apparatusaccording to the first embodiment.

FIG. 12 is a view showing an example of the supporting apparatusaccording to the first embodiment.

FIG. 13 is a view showing an example of the supporting apparatusaccording to the first embodiment.

FIG. 14 is a view showing an example of a driving apparatus according tothe first embodiment.

FIG. 15 is a view showing an example of the driving apparatus accordingto the first embodiment.

FIG. 16 is a view to explain an example of the operation of the exposureapparatus according to the first embodiment.

FIG. 17 is a schematic view to explain an example of the operation ofthe exposure apparatus according to the first embodiment.

FIG. 18 is a schematic view showing an example of an operation of theliquid immersion member according to the first embodiment.

FIG. 19 is a view showing an example of the supporting apparatusaccording to the first embodiment.

FIG. 20 is a side cross-sectional view showing an example of a liquidimmersion member according to a second embodiment.

FIG. 21 is a side cross-sectional view showing an example of the liquidimmersion member according to the second embodiment.

FIG. 22 is a side cross-sectional view showing an example of the liquidimmersion member according to the second embodiment.

FIG. 23 is a view when the liquid immersion member according to thesecond embodiment is viewed from below.

FIG. 24 is a perspective view showing an example of the liquid immersionmember according to the second embodiment.

FIG. 25 is a perspective view showing an example of a supportingapparatus according to a second embodiment.

FIG. 26 is a view showing an example of a supporting part according tothe second embodiment.

FIG. 27 is a view showing an example of a detection apparatus accordingto the second embodiment.

FIG. 28 is a view showing an example of a liquid immersion member.

FIG. 29 is a view showing an example of a liquid immersion member.

FIG. 30 is a view showing an example of a substrate stage.

FIG. 31 is a flowchart for explaining an example of a devicemanufacturing method.

DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the present invention will be described withreference to the drawings. However, the present invention is not limitedthereto. In the descriptions below, an XYZ rectangular coordinate systemis set, and a positional relationship of each portion will be describedreferring to the XYZ rectangular coordinate system. A predetermineddirection in a horizontal surface is set to an X axis direction, adirection orthogonal to the X axis direction in the horizontal surfaceis set to a Y axis direction, and a direction (that is, a verticaldirection) orthogonal to each of the X axis direction and the Y axisdirection is set to a Z axis direction. Moreover, the rotation(inclination) directions around the X axis, the Y axis, and the Z axisare set to the θX direction, the θY direction, and the θZ direction.

First Embodiment

A first embodiment will be described. FIG. 1 is a schematicconfiguration view showing an example of an exposure apparatus EXaccording to the first embodiment. The exposure apparatus EX of thepresent embodiment is a liquid immersion exposure apparatus whichexposes a substrate P via a liquid LQ using exposure light EL. In thepresent embodiment, a liquid immersion space LS is formed so that anoptical path K of the exposure light EL which is radiated to thesubstrate P is filled with the liquid LQ. The liquid immersion spacemeans a portion (space or region) which is filled with the liquid. Thesubstrate P is exposed by the exposure light EL via the liquid LQ in theliquid immersion space LS. In the present embodiment, water (pure water)is used for the liquid LQ.

In addition, for example, the exposure apparatus EX of the presentembodiment is an exposure apparatus which includes a substrate stage anda measurement stage as disclosed in U.S. Pat. No. 6,897,963, EuropeanPatent Application Publication No. 1713113, or the like.

In FIG. 1, the exposure apparatus EX includes: a mask stage 1 which ismovable while holding a mask M; a substrate stage 2 which is movablewhile holding a substrate P; a measurement stage 3 which does not holdthe substrate P, and which is movable while mounting a measurementmember (measurement instrument) C which measures the exposure light EL;a measurement system 4 which measures positions of the substrate stage 2and the measurement stage 3; an illumination system IL which illuminatesthe mask M with the exposure light EL; a projection optical system PLwhich projects an image of a pattern of the mask M which is illuminatedwith the exposure light EL to the substrate P; a liquid immersion member5 which forms the liquid immersion space LS of a liquid LQ; a controller6 which controls an operation of the entire exposure apparatus EX; and astorage apparatus 7 which is connected to the controller 6 and storesvarious information with respect to the exposure.

Moreover, the exposure apparatus EX includes a reference frame 8A whichsupports the projection optical system PL and various measurementsystems including the measurement system 4, an apparatus frame 8B whichsupports the reference frame 8A, and a vibration isolator 10 which isdisposed between the reference frame 8A and the apparatus frame 8B, andsuppresses transmission of vibration from the apparatus frame 8B to thereference frame 8A. The vibration isolator 10 includes a springapparatus or the like. In the present embodiment, the vibration isolator10 includes a gas spring (for example, air mount). In addition, eitherone of a detection system which detects an alignment mark of thesubstrate P and a detection system which detects the position of thesurface of an object such as the substrate P, or both detection systemsmay be supported by the reference frame 8A.

In addition, the exposure apparatus EX includes a chamber apparatus 9which adjusts an environment (at least one of temperature, humidity,pressure, and a degree of cleanness) of a space CS to which the exposurelight EL advances. At least the projection optical system PL, the liquidimmersion member 5, the substrate stage 2, and the measurement stage 3are disposed in the space CS. In the present embodiment, at least aportion of the mask stage 1 and the illumination system IL is alsodisposed in the space CS.

The mask M includes a reticle on which a device pattern projected to thesubstrate P is formed. For example, the mask M includes a transmissiontype mask which includes a transparent plate such as a glass plate, anda pattern formed on the transparent plate using a light-shieldingmaterial such as chromium. Moreover, a reflection type mask may be usedfor the mask M.

The substrate P is a substrate for manufacturing a device. For example,the substrate P includes a base material such as a semiconductor waferand a photosensitive film which is formed on the base material. Thephotosensitive film is a film of a photosensitive material(photoresist). Moreover, the substrate P may include another film inaddition to the photosensitive film. For example, the substrate P mayinclude an antireflection film and a protective film (top coat film)which protects the photosensitive film.

The illumination system IL radiates the exposure light EL to anillumination region IR. The illumination region IR includes positionswhich can be radiated with the exposure light EL emitted from theillumination system IL. The illumination system IL illuminates at leasta portion of the mask M disposed in the illumination region IR by theexposure light EL having a uniform illumination distribution. Forexample, as for the exposure light EL which is emitted from theillumination system IL, far-ultraviolet light (DUV light) such as abright line (g-line, h-line, i-line) emitted from a mercury lamp and KrFexcimer laser light (248 nm in wavelength), ArF excimer laser light (193nm in wavelength), vacuum-ultraviolet light (VUV light) such as F₂ laserlight (157 nm in wavelength), and the like are used. In the presentembodiment, as for the exposure light EL, ArF excimer laser light, whichis an ultraviolet light (vacuum-ultraviolet light), is used.

The mask stage 1 is movable in a state where it holds the mask M. Forexample, the mask stage 1 is moved by an operation of a driving system11 which includes a planar motor as disclosed in U.S. Pat. No.6,452,292. In the present embodiment, the mask stage 1 is able to movein six directions of the X axis, the Y axis, the Z axis, the θX, the θY,and the θZ by the operation of the driving system 11. Moreover, thedriving system 11 may not include a planar motor. For example, thedriving system 11 may include a linear motor.

The projection optical system PL radiates the exposure light EL to aprojection region PR. The projection region PR includes positions whichcan be irradiated with the exposure light EL emitted from the projectionoptical system PL. The projection optical system PL projects the imageof the pattern of the mask M on at least a portion of the substrate Pdisposed in the projection region PR by a predetermined projectionmagnification. In the present embodiment, the projection optical systemPL is a reduction system. The projection magnification of the projectionoptical system PL is ¼. In addition, the projection magnification of theprojection optical system PL may be ⅕, ⅛, or the like. Moreover, theprojection optical system PL may be either an equal magnification systemor an enlargement system. In the present embodiment, the optical axis ofthe projection optical system PL is parallel to the Z axis. Theprojection optical system PL may be any of a refraction system whichdoes not include a reflective optical element, a reflection system whichdoes not include a refractive optical element, or a reflectiverefraction system which includes the reflective optical element and therefractive optical element. The projection optical system PL may formeither an inverted image or an erected image.

The projection optical system PL includes a terminal optical element 13which includes an emitting surface 12 from which the exposure light ELis emitted. The emitting surface 12 emits the exposure light EL towardthe image surface of the projection optical system PL. The terminaloptical element 13 is an optical element nearest to the image surface ofthe projection optical system PL among the plurality of optical elementsof the projection optical system PL. The projection region PR includespositions which can be irradiated with the exposure light EL emittedfrom the emitting surface 12. In the present embodiment, the emittingsurface 12 faces the −Z direction. The exposure light EL emitted fromthe emitting surface 12 advances in the −Z direction. The emittingsurface 12 is parallel to the XY plane. Moreover, the emitting surface12 facing the −Z direction may have a convex surface or a concavesurface. In addition, the emitting surface 12 may be inclined withrespect to the XY plane and include a curved surface. In the presentembodiment, the optical axis of the terminal optical element 13 isparallel to the Z axis.

With respect to the direction parallel to the optical axis of theterminal optical element 13, the emitting surface 12 side is at the −Zside, and the incident surface side is at the +Z side. With respect tothe direction parallel to the optical axis of the projection opticalsystem PL, the image surface side of the projection optical system PL isat the −Z side, and the object surface side of the projection opticalsystem PL is at the +Z side.

The substrate stage 2 is able to move in the XY plane, which includespositions (projection region PR) which can be irradiated with theexposure light EL from the emitting surface 12, in a state where thesubstrate stage holds the substrate P. The measurement stage 3 is ableto move in the XY plane, which includes positions (projection region PR)which can be irradiated with the exposure light EL from the emittingsurface 12, in a state where a measurement member (measurementinstrument) C is mounted on the measurement stage. Each of the substratestage 2 and the measurement stage 3 is able to move on a guide surface14G of a base member 14. The guide surface 14G and the XY plane aresubstantially parallel to each other.

The substrate stage 2 includes a first holding portion which releasablyholds the substrate P and a second holding portion which is disposed atthe surrounding of the first holding portion and releasably holds acover member T as disclosed in, for example, United States PatentApplication Publication No. 2007/0177125, United States PatentApplication Publication No. 2008/0049209, and the like. The firstholding portion holds the substrate P so that the surface (uppersurface) of the substrate P and the XY plane are substantially parallelto each other. The upper surface of the substrate P held by the firstholding portion and the upper surface of the cover member T held by thesecond holding portion are disposed in a substantially same plane.

With respect to the Z axis direction, a distance between the emittingsurface 12 and the upper surface of the substrate P held by the firstholding portion is substantially the same as a distance between theemitting surface 12 and the upper surface of the cover member T held bythe second holding portion. Moreover, with respect to the Z axisdirection, a situation in which the distance between the emittingsurface 12 and the upper surface of the substrate P is substantially thesame as the distance between the emitting surface 12 and the uppersurface of the cover member T includes a situation in which thedifference between the distance between the emitting surface 12 and theupper surface of the substrate P and the distance between the emittingsurface 12 and the upper surface of the cover member T is within, forexample, 10% of the distance (a so-called working distance) between theemitting surface 12 and the upper surface of the substrate P when thesubstrate P is exposed. In addition, the upper surface of the substrateP held by the first holding portion and the upper surface of the covermember T held by the second holding portion may not be disposed in thesame plane. For example, with respect to the Z axis direction, theposition of the upper surface of the substrate P and the position of theupper surface of the cover member T may be different from each other.For example, there may be a step between the upper surface of thesubstrate P and the upper surface of the cover member T. In addition,the upper surface of the cover member T may be inclined with respect tothe upper surface of the substrate P, and the upper surface of the covermember T may include a curved surface.

The substrate stage 2 and the measurement stage 3 are moved by anoperation of a driving system 15 which includes a planar motor asdisclosed in, for example, U.S. Pat. No. 6,452,292. The driving system15 includes a mover 2C which is disposed at the substrate stage 2, amover 3C which is disposed at the measurement stage 3, and a stator 14Mwhich is disposed at the base member 14. Each of the substrate stage 2and the measurement stage 3 is able to move on a guide surface 14G insix directions of the X axis, the Y axis, the Z axis, the θX, the θY,and the θZ directions by the operation of the driving system 15.Moreover, the driving system 15 may not include a planar motor. Thedriving system 15 may include a linear motor.

The measurement system 4 includes an interferometer system. Theinterferometer system includes a unit which radiates measurement lightto a measurement mirror of the substrate stage 2 and a measurementmirror of the measurement stage 3 and measures the positions of thesubstrate stage 2 and the measurement stage 3. In addition, for example,the measurement system may include an encoder system as disclosed inUnited States Patent Application Publication No. 2007/0288121. Inaddition, the measurement system 4 may include only one of theinterferometer system and the encoder system.

When exposure processing of the substrate P is performed, or whenpredetermined measurement processing is performed, the controller 6performs a position control of the substrate stage 2 (substrate P) andthe measurement stage 3 (measurement member C) based on the measurementresults of the measurement system 4.

Next, the liquid immersion member 5 according to the present embodimentwill be described. In addition, the liquid immersion member may also bereferred to as a nozzle member. FIG. 2 is a cross-sectional view of theliquid immersion member 5 parallel to the XZ plane. FIG. 3 is a view inwhich a portion of FIG. 2 is enlarged. FIG. 4 is a view showing anexample of the operation of the liquid immersion member 5. FIG. 5 is aview when the liquid immersion member 5 is viewed from below (−Z side).FIGS. 6 and 7 are exploded perspective views of the liquid immersionmember 5.

The liquid immersion member 5 forms a liquid immersion space LS of theliquid LQ above the object which is movable below the terminal opticalelement 13.

The object which is movable below the terminal optical element 13 isable to move in the XY plane which includes the position opposite to theemitting surface 12. The object is able to be opposite to the emittingsurface 12 and be disposed in the projection region PR. The object isable to move below the liquid immersion member 5 and is able to beopposite to the liquid immersion member 5. In the present embodiment,the object includes at least one of at least a portion of the substratestage 2 (for example, the cover member T of the substrate stage 2), thesubstrate P which is held by the substrate stage 2 (first holdingportion), and the measurement stage 3. In the exposure of the substrateP, the liquid immersion space LS is formed so that the optical path K ofthe exposure light EL between the emitting surface 12 of the terminaloptical element 13 and the substrate P is filled with the liquid LQ.When the exposure light EL is radiated to the substrate P, the liquidimmersion space LS is formed so that only a portion of the surfaceregion of the substrate P which includes the projection region PR iscovered by the liquid LQ.

In the descriptions below, the object is the substrate P. Moreover, asdescribed above, the object may be at least one of the substrate stage 2and the measurement stage 3, and the object may be other than thesubstrate P, the substrate stage 2, and the measurement stage 3.

There is a case in which the liquid immersion space LS may be formedover two objects. For example, there is a case in which the liquidimmersion space LS may be formed over the cover member T of thesubstrate stage 2 and the substrate P. There is a case in which theliquid immersion space LS may be formed over the substrate stage 2 andthe measurement stage 3.

The liquid immersion space LS is formed so that the optical path K ofthe exposure light EL emitted from the emitting surface 12 of theterminal optical element 13 is filled with the liquid LQ. At least aportion of the liquid immersion space LS is formed in a space betweenthe terminal optical element 13 and the substrate P (object). At least aportion of the liquid immersion space LS is formed in a space betweenthe liquid immersion member 5 and the substrate P (object).

The liquid immersion member 5 includes a first member 21 which isdisposed at at least a portion of the surrounding of the terminaloptical element 13, and a second member 22 which is disposed at at leasta portion of the surrounding of the optical path K below the firstmember 21. The second member 22 is movable with respect to the firstmember 21.

The first member 21 is disposed at a position further away from thesubstrate P (object) than the second member 22. At least a portion ofthe second member 22 is disposed between the first member 21 and thesubstrate P (object). At least a portion of the second member 22 isdisposed between the terminal optical element 13 and the substrate P(object). In addition, the second member 22 may not be disposed betweenthe terminal optical element 13 and the substrate P (object).

The first member 21 includes a lower surface 23 facing the −Z directionand a fluid recovery part 24 which is disposed at at least a portion ofthe surrounding of the lower surface 23. The second member 22 includesan upper surface 25 facing the +Z direction, a lower surface 26 facingthe −Z direction, and a fluid recovery part 27 which is disposed at atleast a portion of the surrounding of the lower surface 26. The fluidrecovery part 24 recovers at least a portion of the liquid LQ of theliquid immersion space LS. The fluid recovery part 27 recovers at leasta portion of the liquid LQ of the liquid immersion space LS.

The first member 21 includes an inner surface 28 which is opposite to aside surface 13F of the terminal optical element 13, and an outersurface 29 toward the outside with respect to the optical path K(optical axis of the terminal optical element 13). The second member 22includes an inner surface 30 which is opposite to the outer surface 29via a gap.

The inner surface 28 of the first member 21 is opposite to the sidesurface 13F of the terminal optical element 13 via a gap.

The second member 22 is able to be opposite to the lower surface 23. Thesecond member 22 is able to be opposite to the fluid recovery part 24.At least a portion of the upper surface 25 of the second member 22 isopposite to the lower surface 23 via a gap. At least a portion of theupper surface 25 is opposite to the emitting surface 12 via a gap.Moreover, the upper surface 25 may not be opposite to the emittingsurface 12.

The substrate P (object) is able to be opposite to the lower surface 26.The substrate P (object) is able to be opposite to at least a portion ofthe fluid recovery part 27. At least a portion of the upper surface ofthe substrate P is opposite to the lower surface 26 via a gap. At leasta portion of the upper surface of the substrate P is opposite to theemitting surface 12 via a gap.

In the Z axis direction, a size of the gap between the upper surface ofthe substrate P (object) and the emitting surface 12 is larger than asize of the gap between the upper surface of the substrate P and thelower surface 26. Moreover, the size of the gap between the uppersurface of the substrate P (object) and the emitting surface 12 may besubstantially the same as the size of the gap between the upper surfaceof the substrate P and the lower surface 26. In addition, the size ofthe gap between the upper surface of the substrate P (object) and theemitting surface 12 may be smaller than a size of the gap between theupper surface of the substrate P and the lower surface 26.

A first space SP1 is formed between the lower surface 23 and the uppersurface 25. A second space SP2 is formed between the lower surface 26and the upper surface of the substrate P (object). A third space SP3 isformed between the side surface 13F and the inner surface 28.

The upper surface 25 has liquid repellent property against the liquidLQ. In the present embodiment, the upper surface 25 includes a surfaceof a resin film which includes fluorine. The upper surface 25 include asurface of a PFA (Tetra fluoro ethylene-perfluoro alkylvinyl ethercopolymer) film. Moreover, the upper surface 25 may include a surface ofPTFE (Poly tetra fluoro ethylene) film. A contact angle of the uppersurface 25 with respect to the liquid LQ is larger than 90°. Inaddition, for example, the contact angle of the upper surface 25 withrespect to the liquid LQ may be larger than 100°, may be larger than110°, and may be larger than 120°.

Since the upper surface 25 has liquid repellent property with respect tothe liquid LQ, occurrence of a gas portion in the liquid LQ in the firstspace SP1 or mixing of bubbles into the liquid LQ is suppressed.

Moreover, the contact angle of the upper surface 25 with respect to theliquid LQ may be larger than the contact angle of the upper surface ofthe substrate P with respect to the liquid LQ. In addition, the contactangle of the upper surface 25 with respect to the liquid LQ may besmaller than the contact angle of the upper surface of the substrate Pwith respect to the liquid LQ. Moreover, the contact angle of the uppersurface 25 with respect to the liquid LQ may be substantially equal tothe contact angle of the upper surface of the substrate P with respectto the liquid LQ.

In addition, the upper surface 25 may have a hydrophilic property withrespect to the liquid LQ. The contact angle of the upper surface 25 withrespect to the liquid LQ may be smaller than 90°, may be smaller than80°, and may be smaller than 70°. Accordingly, the liquid LQ smoothlyflows in the first space SP1.

Moreover, the lower surface 23 may have liquid repellent property withrespect to liquid LQ. For example, both of the lower surface 23 and theupper surface 25 may have liquid repellent property with respect toliquid LQ. The contact angle of the lower surface 23 with respect to theliquid LQ may be larger than 90°, may be larger than 100°, may be largerthan 110°, and may be larger than 120°.

In addition, the lower surface 23 may have liquid repellent propertywith respect to the liquid LQ, and the upper surface 25 may havehydrophilic property with respect to the liquid LQ. The contact angle ofthe lower surface 23 with respect to the liquid LQ may be larger thanthe contact angle of the upper surface 25 with respect to the liquid LQ.

Moreover, the lower surface 23 may have hydrophilic property withrespect to the liquid LQ. For example, both of the lower surface 23 andthe upper surface 25 may have hydrophilic property with respect toliquid LQ. The contact angle of the lower surface 23 with respect to theliquid LQ may be smaller than 90°, may be smaller than 80°, and may besmaller than 70°.

In addition, the lower surface 23 may have hydrophilic property withrespect to the liquid LQ, and the upper surface 25 may have liquidrepellent property with respect to the liquid LQ. The contact angle ofthe lower surface 23 with respect to the liquid LQ may be smaller thanthe contact of the upper surface 25 with respect to the liquid LQ.

In the present embodiment, the lower surface 26 has hydrophilic propertywith respect to the liquid LQ. The contact angle of the lower surface 26with respect to the liquid LQ may be smaller than 90°, may be smallerthan 80°, and may be smaller than 70°. In the present embodiment, thecontact angle of the lower surface 26 with respect to the liquid LQ issmaller than the contact angle of the upper surface of the substrate Pwith respect to the liquid LQ. Moreover, the contact angle of the lowersurface 26 with respect to the liquid LQ may be larger than or besubstantially equal to the contact angle of the upper surface of thesubstrate P with respect to the liquid LQ.

The side surface 13F of the terminal optical element 13 is disposed atthe surrounding of the emitting surface 12. The side surface 13F is anon-emitting surface from which the exposure light EL is not emitted.The exposure light EL passes through the emitting surface 12 and doesnot pass through the side surface 13F.

The lower surface 23 of the first member 21 does not recover the liquidLQ. The lower surface 23 is a non-recovery part and is not able torecover the liquid LQ. The lower surface 23 of the first member 21 isable to hold the liquid LQ between the lower surface and the secondmember 22.

The upper surface 25 of the second member 22 does not recover the liquidLQ. The upper surface 25 is a non-recovery part and is not able torecover the liquid LQ. The upper surface 25 of the second member 22 isable to hold the liquid LQ between the upper surface 25 and the firstmember 21.

The lower surface 26 of the second member 22 does not recover the liquidLQ. The lower surface 26 is a non-recovery part and is not able torecover the liquid LQ. The lower surface 26 of the second member 22 isable to hold the liquid LQ between the substrate P (object) and thelower surface 26.

The inner surface 28, the outer surface 29, and the inner surface 30 donot recover the liquid LQ. The inner surface 28, the outer surface 29,and the inner surface 30 are non-recovery parts and they are not able torecover the liquid LQ.

In the present embodiment, the lower surface 23 is substantiallyparallel to the XY plane. The upper surface 25 is also substantiallyparallel to the XY plane. The lower surface 26 is also substantiallyparallel to the XY plane. That is, the lower surface 23 and the uppersurface 25 are substantially parallel to each other. The upper surface25 and the lower surface 26 are substantially parallel to each other.

Moreover, the lower surface 23 may not be parallel to the XY plane. Thelower surface 23 may be inclined with respect to the XY plane and mayinclude a curved surface.

In addition, the upper surface 25 may not be parallel to the XY plane.The upper surface 25 may be inclined with respect to the XY plane andmay include a curved surface.

Moreover, the lower surface 26 may not be parallel to the XY plane. Thelower surface 26 may be inclined with respect to the XY plane and mayinclude a curved surface.

In addition, the lower surface 23 and the upper surface 25 may beparallel to each other and may not be parallel to each other. The uppersurface 25 and the lower surface 26 may be parallel to each other or maynot be parallel to each other. The lower surface 23 and the lowersurface 26 may be parallel to each other and may not be parallel to eachother.

The first member 21 includes an opening 34 through which the exposurelight EL emitted from the emitting surface 12 is able to pass. Thesecond member 22 includes an opening 35 through which the exposure lightEL emitted from the emitting surface 12 is able to pass. At least aportion of the terminal optical element 13 is disposed at the inner sideof the opening 34. The lower surface 23 is arranged at the surroundingof the lower end of the opening 34. The upper surface 25 is arranged atthe surrounding of the upper end of the opening 35. The lower surface 26is arranged at the surrounding of the lower end of the opening 35.

In the present embodiment, at least a portion of an inner surface 35U ofthe second member 22, which defines the opening 35 facing the opticalpath K, is inclined upwardly and outwardly in a radial direction fromthe optical path K. Accordingly, the second member 22 is able tosmoothly move in a state where the inner surface 35U of the secondmember 22 is disposed in the liquid immersion space LS. Moreover, evenwhen the second member 22 moves in a state where the inner surface 35Uof the second member 22 is disposed in the liquid immersion space LS, achange in a pressure of the liquid LQ in the liquid immersion space LSis suppressed.

The size of the opening 34 in the XY plane is larger than the size ofthe opening 35. With respect to the X axis direction, the size of theopening 34 is larger than the size of the opening 35. With respect tothe Y axis direction, the size of the opening 34 is larger than the sizeof the opening 35. In the present embodiment, the first member 21 is notdisposed immediately below the emitting surface 12. The opening 34 ofthe first member 21 is disposed at the surrounding of the emittingsurface 12. The opening 34 is larger than the emitting surface 12. Thelower end of the gap which is formed between the side surface 13F of theterminal optical element 13 and the first member 21 faces the uppersurface 25 of the second member 22. Moreover, the opening 35 of thesecond member 22 is disposed to be opposite to the emitting surface 12.In the present embodiment, the shape of the opening 35 in the XY planeis a rectangular shape. The opening 35 is long in the X axis direction.Moreover, the shape of the opening 35 may be an elliptical shape whichis long in the X axis direction and may be a polygonal shape which islong in the X axis direction.

In addition, the size of the opening 34 may be smaller than the size ofthe opening 35. Moreover, the size of the opening 34 may besubstantially the same as the size of the opening 35.

The first member 21 is disposed at the surrounding of the terminaloptical element 13. The first member 21 is an annular member. The firstmember 21 is disposed so as not to contact the terminal optical element13. A gap is formed between the first member 21 and the terminal opticalelement 13. The first member 21 is not opposite to the emitting surface12. Moreover, a portion of the first member 21 may not be opposite tothe emitting surface 12. That is, a portion of the first member 21 maybe disposed between the emitting surface 12 and the upper surface of thesubstrate P (object). In addition, the first member 21 may not beannular. For example, the first member 21 may be disposed at a portionof the surrounding of the terminal optical element 13 (optical path K).For example, a plurality of first members 21 may be disposed at thesurrounding of the terminal optical element 13 (optical path K).

The second member 22 is disposed at a surrounding of the optical path K.The second member 22 is an annular member. The second member 22 isdisposed so as not to contact the first member 21. A gap is formedbetween the second member 22 and the first member 21.

The second member 22 is able to relatively move with respect to thefirst member 21. The second member 22 is able to relatively move withrespect to the terminal optical element 13. The relative positionbetween the second member 22 and the first member 21 is changed. Therelative position between the second member 22 and the terminal opticalelement 13 is changed.

The second member 22 is able to relatively move in the XY planeperpendicular to the optical axis of the terminal optical element 13.The second member 22 is able to move to be substantially parallel to theXY plane. As shown in FIG. 4, in the present embodiment, the secondmember 22 is able to move in at least the X axis direction. Moreover,the second member 22 is able to move in at least one direction of the Yaxis, the Z axis, the θX, the θY, and the θZ directions, in addition tothe X axis direction.

In the present embodiment, the terminal optical element 13 does notsubstantially move. The first member 21 also does not substantiallymove.

The second member 22 is able to move below at least a portion of thefirst member 21. The second member 22 is able to move between the firstmember 21 and the substrate P (object).

The second member 22 moves in the XY plane, and thus, the size of thegap between the outer surface 29 of the first member 21 and the innersurface 30 of the second member 22 is changed. In other words, thesecond member 22 moves in the XY plane, and thus, the size of the spacebetween the outer surface 29 and the inner surface 30 is changed. Forexample, in the example shown in FIG. 4, the second member 22 moves inthe −X direction, and thus, the size of the gap between the outersurface 29 and the inner surface 30 is decreased (the space between theouter surface 29 and the inner surface 30 is decreased) in the +X sidewith respect to the terminal optical element 13. The second member 22moves in the +X direction, and thus, the size of the gap between theouter surface 29 and the inner surface 30 is increased (the spacebetween the outer surface 29 and the inner surface 30 is increased) inthe +X side with respect to the terminal optical element 13.

In the present embodiment, a movable range of the second member 22 isdetermined so that the first member 21 (outer surface 29) and the secondmember 22 (inner surface 30) do not contact each other.

The second member 22 may move in at least a part of a period in whichthe exposure light EL is emitted from the emitting surface 12. Thesecond member 22 may move in at least a part of a period in which theexposure light EL is emitted from the emitting surface 12 in a statewhere the liquid immersion space LS is formed.

The second member 22 may move in parallel with at least a part of aperiod in which the substrate P (object) moves. The second member 22 maymove in parallel with at least a part of a period in which the substrateP (object) moves in the state where the liquid immersion space LS isformed.

The second member 22 may move in the movement direction of the substrateP (object). For example, the second member 22 may be moved in themovement direction of the substrate P in at least a part of a period inwhich the substrate P is moved. For example, when the substrate P movesin one direction (for example, +X direction) in the XY plane, the secondmember 22 may move in one direction (the +X direction) in the XY planein synchronization with the movement of the substrate P.

The liquid immersion member 5 includes a liquid supply part 31 whichsupplies the liquid LQ to form the liquid immersion space LS. The liquidsupply part 31 is disposed at the first member 21.

Moreover, the liquid supply part 31 may be disposed at both of the firstmember 21 and the second member 22.

In addition, the liquid supply part 31 may be disposed at the firstmember 21 and not be disposed at the second member 22. In addition, theliquid supply part 31 may be disposed at the second member 22 and not bedisposed at the first member 21. Moreover, the liquid supply part 31 maybe disposed at members other than the first member 21 and the secondmember 22.

The liquid supply part 31 is disposed inside the fluid recovery part 24and the fluid recovery part 27 in the radial direction from the opticalpath K (the optical axis of the terminal optical element 13). In thepresent embodiment, the liquid supply part 31 includes an opening(liquid supply port) which is disposed at the inner surface 28 of thefirst member 21. The liquid supply part 31 is disposed to be opposite tothe side surface 13F. The liquid supply part 31 supplies the liquid LQto the third space SP3 between the side surface 13F and the innersurface 28. In the present embodiment, the liquid supply part 31 isdisposed at each of the +X side and the −X side with respect to theoptical path K (terminal optical element 13).

Moreover, the liquid supply part 31 may be disposed at the Y axisdirection with respect to the optical path K (terminal optical element13), and the plurality of liquid supply parts may be disposed at thesurrounding of the optical path K (terminal optical element 13) whichincludes the X axis direction and the Y axis direction. One liquidsupply part 31 may be provided. In addition, instead of the liquidsupply part 31 or in addition to the liquid supply part 31, a liquidsupply part which is able to supply the liquid LQ may be provided at thelower surface 23.

In the present embodiment, the liquid supply part (liquid supply port)31 is connected to a liquid supply apparatus 31S via a supply channel31R which is formed in the inner portion of the first member 21. Theliquid supply apparatus 31S is able to supply the cleaned liquid LQ, inwhich the temperature is adjusted, to the liquid supply part 31. Inorder to form the liquid immersion space LS, the liquid supply part 31supplies the liquid LQ from the liquid supply apparatus 31S.

An opening 40 is formed between the inner edge of the lower surface 23and the upper surface 25. An optical path space SPK which includes theoptical path K between the emitting surface 12 and the substrate P(object) and the first space SP1 between the lower surface 23 and theupper surface 25 are connected to each other via the opening 40. Theoptical path space SPK includes the space between the emitting surface12 and the substrate P (object) and the space between the emittingsurface 12 and the upper surface 25. The opening 40 is disposed so as toface the optical path K. The third space SP3 between the side surface13F and the inner surface 28 and the first space SP1 are connected toeach other via the opening 40.

At least a portion of the liquid LQ from the liquid supply part 31 issupplied to the first space SP1 between the lower surface 23 and theupper surface 25 via the opening 40. At least a portion of the liquidLQ, which is supplied from the liquid supply part 31 to form the liquidimmersion space LS, is supplied to the substrate P (object) opposite tothe emitting surface 12 via the opening 34 and the opening 35.Accordingly, the optical path K is filled with the liquid LQ. At least aportion of the liquid LQ from the liquid supply part 31 is supplied tothe second space SP2 between the lower surface 26 and the upper surfaceof the substrate P (object).

With respect to the Z axis direction, the size of the first space SP1 issmaller than the size of the second space SP2. In addition, with respectto the Z axis direction, the size of the first space SP1 may besubstantially the same as the size of the second space SP2 and may belarger than the size of the second space SP2.

The fluid recovery part 24 is disposed outside the lower surface 23 withrespect to the optical path K (with respect to an optical axis of theterminal optical element 13). The fluid recovery part 24 is disposed atsurrounding of the lower surface 23. The fluid recovery part 24 isdisposed at surrounding of the optical path K of the exposure light EL.Moreover, the fluid recovery part 24 may be disposed at a portion ofsurrounding of the lower surface 23. For example, a plurality of thefluid recovery parts 24 may be disposed at surrounding of the lowersurface 23. The fluid recovery part 24 is disposed to face the firstspace SP1. The fluid recovery part 24 recovers at least a portion of theliquid LQ in the first space SP1.

A fluid recovery part 27 is disposed outside the lower surface 26 withrespect to the optical path K (with respect to an optical axis of theterminal optical element 13). The fluid recovery part 27 is disposed atsurrounding of the lower surface 26. The fluid recovery part 27 isdisposed at surrounding of the optical path K of the exposure light EL.Moreover, the fluid recovery part 27 may be disposed at a portion ofsurrounding of the lower surface 26. For example, a plurality of thefluid recovery parts 27 may be disposed at surrounding of the lowersurface 26. The fluid recovery part 27 is disposed so as to oppose thesecond space SP2. The fluid recovery part 27 recovers at least a portionof the liquid LQ in the second space SP2.

The fluid recovery part 27 is disposed outside the first member 21 withrespect to the optical path K (the optical axis of the terminal opticalelement 13). The fluid recovery part 27 is disposed outside the firstspace SP1 with respect to the optical path K (the optical axis of theterminal optical element 13).

In the present embodiment, movement of the liquid LQ from one of thefirst space SP1 at the upper surface 25 side and the second space SP2 atthe lower surface 26 side to the other is suppressed. The first spaceSP1 and the second space SP2 are partitioned by the second member 22.The liquid LQ in the first space SP1 is able to move to the second spaceSP2 via the opening 35. The liquid LQ in the first space SP1 is able tomove to the second space SP2 only through the opening 35. The liquid LQ,which is present in the first space SP1 further outside than the opening35 from the optical path K, is not able to move to the second space SP2.The liquid LQ in the second space SP2 is able to move to the first spaceSP1 via the opening 35. The liquid LQ in the second space SP2 is able tomove to the first space SP1 only through the opening 35. The liquid LQ,which is present in the second space SP2 further outside than theopening 35 from the optical path K, is not able to move to the firstspace SP1. That is, in the present embodiment, the liquid immersionmember 5 does not have a channel which fluidly connects the first spaceSP1 and the second space SP2, other than the opening 35.

In the present embodiment, the fluid recovery part 27 recovers at leasta portion of the liquid LQ in the second space SP2 and does not recoverthe liquid LQ in the first space SP1. The fluid recovery part 24recovers at least a portion of the liquid LQ in the first space SP1 anddoes not recover the liquid LQ in the second space SP2.

Moreover, the liquid LQ, which moves outside (outside the outer surface29) the first space SP1 from the optical path K, is suppressed frombeing moved to the substrate P (second space SP2) due to the innersurface 30.

The fluid recovery part 24 includes an opening (fluid recovery port)which is disposed at at least a portion of surrounding of the lowersurface 23 of the first member 21. The fluid recovery part 24 isdisposed to be opposite to the upper surface 25. The fluid recovery part24 is connected to a liquid recovery apparatus 24C via a recoverychannel (space) 24R which is formed in the inner portion of the firstmember 21. The liquid recovery apparatus 24C is able to connect thefluid recovery part 24 and a vacuum system. The fluid recovery part 24is able to recover at least a portion of the liquid LQ in the firstspace SP1. At least a portion of the liquid LQ in the first space SP1 isable to flow into the recovery channel 24R via the fluid recovery part24.

In the present embodiment, the fluid recovery part 24 includes a porousmember 36, and the fluid recovery port includes holes of the porousmember 36. In the present embodiment, the porous member 36 includes amesh plate. The porous member 36 includes a lower surface to which theupper surface 25 is able to be opposite, an upper surface which facesthe recovery channel 24R, and the plurality of holes which connect thelower surface and the upper surface. The fluid recovery part 24 recoversthe liquid LQ via the holes of the porous member 36. The liquid LQ inthe first space SP1 recovered from the fluid recovery part 24 (holes ofthe porous member 36) flows into the recovery channel 24R, flows to therecovery channel 24R, and is recovered by the liquid recovery apparatus24C.

In the present embodiment, substantially only the liquid LQ is recoveredvia the fluid recovery part 24, and the recovery of gas via the fluidrecovery part 24 is limited. A controller 6 adjusts a pressuredifference between pressure (pressure of the first space SP1) at thelower surface side of the porous member 36 and pressure (pressure of therecovery channel 24R) at the upper surface side of the porous member 36so that the liquid LQ in the first space SP1 passes through the holes ofthe porous member 36 and flows into the recovery channel 24R and gasdoes not pass through the holes of the porous member 36. Moreover, forexample, an example of technology which recovers only liquid via theporous member is disclosed in U.S. Pat. No. 7,292,313 or the like.

In addition, both of the liquid LQ and the gas may be recovered (sucked)via the porous member 36. Moreover, the porous member 36 may not beprovided at the first member 21. That is, the fluid (one or both ofliquid LQ and gas) in the first space SP1 may be recovered withoutthrough the porous member.

In the present embodiment, the lower surface of the fluid recovery part24 includes the lower surface of the porous member 36. The lower surfaceof the fluid recovery part 24 is disposed at the surrounding of thelower surface 23. In the present embodiment, the lower surface of thefluid recovery part 24 is substantially parallel with the XY plane. Inthe present embodiment, the lower surface of the fluid recovery part 24and the lower surface 23 are disposed in the same plane (flush with eachother).

Moreover, the lower surface of the fluid recovery part 24 may bedisposed more at the +Z side than the lower surface 23 and may bedisposed more at the −Z side than the lower surface 23. In addition, thelower surface of the fluid recovery part 24 may be inclined with respectto the lower surface 23 and may include a curved surface.

Moreover, the fluid recovery part 24 for recovering the fluid (one orboth of liquid LQ and gas) in the first space SP1 may be disposed at thesecond member 22 to face the first space SP1. The fluid recovery part 24may be disposed at both of the first member 21 and the second member 22.The fluid recovery part 24 may be disposed at the first member 21 andmay not be disposed at the second member 22. The fluid recovery part 24may be disposed at the second member 22 and may not be disposed at thefirst member 21.

The fluid recovery part 27 includes an opening (fluid recovery port)which is disposed at at least a portion of the surrounding of the lowersurface 26 of the second member 22. The fluid recovery part 27 isdisposed to be opposite to the upper surface of the substrate P(object). The fluid recovery part 27 is connected to a liquid recoveryapparatus 27C via a recovery channel (space) 27R which is formed in theinner portion of the second member 22. The liquid recovery apparatus 27Cis able to connect the fluid recovery part 27 and a vacuum system. Thefluid recovery part 27 is able to recover at least a portion of theliquid LQ at the second space SP2. At least a portion of the liquid LQat the second space SP2 is able to flow into the recovery channel 27Rvia the fluid recovery part 27.

In the present embodiment, the fluid recovery part 27 includes a porousmember 37, and the fluid recovery port includes holes of the porousmember 37. In the present embodiment, the porous member 37 includes amesh plate. The porous member 37 includes a lower surface to which theupper surface of the substrate P (object) is able to be opposite, anupper surface which faces the recovery channel 27R, and the plurality ofholes which connect the lower surface and the upper surface. The liquidrecovery part 27 recovers the fluid (one or both of the liquid LQ andthe gas) via the holes of the porous member 37. The liquid LQ in thesecond space SP2 recovered from the fluid recovery part 27 (holes of theporous member 37) flows into the recovery channel 27R, flows to therecovery channel 27R, and is recovered by the liquid recovery apparatus27C.

The recovery channel 27R is disposed outside the inner surface 30 withrespect to the optical path K (the optical axis of the terminal opticalelement 13). The recovery channel 27R is disposed above the liquidrecovery part 27. The second member 22 moves, and thus, the fluidrecovery part 27 and the recovery channel 27R of the second member 22moves outside the outer surface 29 of the first member 21.

The gas is recovered via the fluid recovery part 27 along with theliquid LQ. Moreover, only the liquid LQ is recovered via the porousmember 37, and the recovery of the gas via the porous member 37 may belimited. In addition, the porous member 37 may not be provided at thesecond member 22. That is, the fluid (one or both of liquid LQ and gas)in the second space SP2 may be recovered without through the porousmember.

In the present embodiment, the lower surface of the fluid recovery part27 includes the lower surface of the porous member 37. The lower surfaceof the fluid recovery part 27 is disposed at the surrounding of thelower surface 26. In the present embodiment, the lower surface of thefluid recovery part 27 is substantially parallel with the XY plane. Inthe present embodiment, the lower surface of the fluid recovery part 27may be disposed more at the +Z side than the lower surface 26.

Moreover, the lower surface of the fluid recovery part 27 and the lowersurface 26 may be disposed in the same plane (may be flush with eachother). The lower surface of the fluid recovery part 27 may be disposedmore at the −Z side than the lower surface 26. In addition, the lowersurface of the fluid recovery part 27 may be inclined with respect tothe lower surface 26 and may include a curved surface.

In the present embodiment, since the recovery operation of the liquid LQfrom the fluid recovery part 27 is performed in parallel with the supplyoperation of the liquid LQ from the liquid supply part 31, the liquidimmersion space LS is formed between the terminal optical element 13 andthe liquid immersion member 5 at one side and the substrate P (object)at the other side, by the liquid LQ.

Moreover, in the present embodiment, the recovery operation of the fluidfrom the fluid recovery part 24 is performed in parallel with the supplyoperation of the liquid LQ from the liquid supply part 31 and therecovery operation of the fluid from the fluid recovery part 27.

The second member 22 may be moved in parallel with the supply of theliquid LQ from the liquid supply part 31.

The second member 22 may be moved in parallel with the recovery of theliquid LQ from the fluid recovery part 24. The second member 22 may bemoved in parallel with the recovery of the liquid LQ from the fluidrecovery part 27. The second member 22 may be moved in parallel with thesupply of the liquid LQ from the liquid supply part 31 and the recoveryof the liquid LQ from the fluid recovery part 24 (fluid recovery part27).

In the present embodiment, a portion of an interface LG of the liquid LQin the liquid immersion space LS is formed between the second member 22and the substrate P (object).

In the present embodiment, a portion of the interface LG of the liquidLQ in the liquid immersion space LS is formed between the first member21 and the second member 22.

In the present embodiment, a portion of the interface LG of the liquidLQ in the liquid immersion space LS is formed between the terminaloptical element 13 and the first member 21.

In the descriptions below, the interface LG of the liquid LQ which isformed between the first member 21 and the second member 22 isappropriately referred to as a first interface LG1. The interface LGwhich is formed between the second member 22 and the substrate P(object) is appropriately referred to as a second interface LG2. Theinterface LG which is formed between the terminal optical element 13 andthe first member 21 is appropriately referred to as a third interfaceLG3.

In the present embodiment, the first interface LG1 is formed between thelower surface of the liquid recovery part 24 and the upper surface 25.The second interface LG2 is formed between the lower surface of theliquid recovery part 27 and the upper surface of the substrate P(object).

In the present embodiment, the first interface LG1 is formed between thelower surface of the liquid recovery part 24 and the upper surface 25,and the movement of the liquid LQ in the first space SP1 to the space(for example, the space between the outer surface 29 and the innersurface 30) outside the liquid recovery part 24 is suppressed. Theliquid LQ is not present in the space between the outer surface 29 andthe inner surface 30. The space between the outer surface 29 and theinner surface 30 becomes a space with gas.

The space between the outer surface 29 and the inner surface 30 isconnected to the space CS. In other words, the space between the outersurface 29 and the inner surface 30 is opened to the atmosphere. Whenthe pressure of the space CS is at atmospheric pressure, the spacebetween the outer surface 29 and the inner surface 30 is opened to theatmosphere. Accordingly, the second member 22 is able to smoothly move.Moreover, the pressure of the space CS may be higher or lower than theatmospheric pressure.

FIG. 8 is a view when the first member 21 is viewed from the lowersurface 23 side. In the present embodiment, an introducing part 38,which introduces at least a portion of the liquid LQ from the liquidsupply part 31, is disposed at the lower surface 23 of the first member21. The introducing part 38 is a protruding part which is provided atthe lower surface 23. The introducing part 38 introduces at least aportion of the liquid LQ from the liquid supply part 31 to the fluidrecovery part 24.

The shape of the introducing part 38 is determined based on the movementdirection of the second member 22. In the present embodiment, theintroducing part 38 is provided to promote the flow of the liquid LQ inthe direction parallel to the movement direction of the second member22.

For example, when the second member 22 moves in the X axis direction,the shape of the introducing part 38 is determined so that the liquid LQflows in the direction parallel to the X axis direction in the firstspace SP1 and reaches the fluid recovery part 24. For example, when thesecond member 22 moves in the +X direction, at least a portion of theliquid LQ in the first space SP1 flows in the +X direction by theintroducing part 38. When the second member 22 moves in the −Xdirection, at least a portion of the liquid LQ in the first space SP1flows in the −X direction by the introducing part 38.

In the present embodiment, the introducing part 38 includes a wall part38R which is disposed at at least a portion of the surrounding of theopening 34 and a slit (opening) 38K which is formed at a portion of thewall part 38R.

The wall part 38 is disposed to surround the opening 34. The slit 38K isformed at each of the +X side and the −X side with respect to theoptical path K so that the flow of the liquid LQ in the directionparallel to the X axis direction is promoted.

Due to the introducing part 38, a flow rate of the liquid LQ in thefirst space SP1 is increased with respect to the direction parallel tothe movement direction of the second member 22. In the presentembodiment, due to the introducing part 38, the flow rate of the liquidLQ is increased with respect to the X axis direction in the first spaceSP1. That is, velocity of the liquid LQ, which flows toward the spacebetween the lower surface of the fluid recovery part 24 and the uppersurface 25, is increased. Accordingly, the change of the position of thefirst interface LG1 with respect to the first member 21 or the change ofthe shape of the first interface LG1 is suppressed. Therefore, theliquid LQ in the first space SP1 is suppressed from being flowed outsidethe first space SP1.

Moreover, the position at which the slit 38K is formed is not limited tothe +X side and the −X side with respect to the optical path K. Forexample, when the second member 22 moves to be parallel with the Y axis,the slit 38K may be added to the +Y side and the −Y side with respect tothe optical path K. When the second member 22 does not move to beparallel with the Y axis, the slit 38K may be added to the +Y side andthe −Y side with respect to the optical path K.

In addition, the shape (position or the like of the slit 38K) of theintroducing part 38 may not be determined based on the movementdirection of the second member 22. For example, the shape of theintroducing part 38 may be determined so that the liquid LQ radiallyflows with respect to the optical path K in the entire circumference ofthe optical path K.

In the present embodiment, the second member 22 is able to be oppositeto the entire lower surface 23. For example, as shown in FIG. 2, whenthe second member 22 is disposed at an origin where the optical axis ofthe terminal optical element 13 and the center of the opening 35substantially coincide with each other, the entire lower surface 23 isopposite to the upper surface 25 of the second member 22. In addition,when the second member 22 is disposed at the origin, a portion of theemitting surface 12 is opposite to the upper surface 25 of the secondmember 22. Moreover, when the second member 22 is disposed at theorigin, the lower surface of the fluid recovery part 24 is opposite tothe upper surface 25 of the second member 22.

In addition, in the present embodiment, when the second member 22 isdisposed at the origin, the center of the opening 34 substantiallycoincides with the center of the opening 35.

Next, an example of the operation of the second member 22 will bedescribed. The second member 22 is able to cooperatively move with themovement of the substrate P (object). The second member 22 is able tomove to be independent of the substrate P (object). The second member 22is able to move in parallel with at least a portion of the movement ofthe substrate P (object). The second member 22 is able to move in astate where the liquid immersion space LS is formed. The second member22 is able to move in a state where the liquid LQ is present in thefirst space SP1 and the second space SP2.

The second member 22 may move when the second member 22 and thesubstrate (object) are not opposite to each other. For example, thesecond member 22 may move when the object is not present below thesecond member 22. Moreover, the second member 22 may move when theliquid LQ is not present in the space between the second member 22 andthe substrate P (object). For example, the second member 22 may movewhen the liquid immersion space LS is not formed.

For example, the second member 22 is moved based on movement conditionsof the substrate P (object). For example, the controller 6 moves thesecond member 22 in parallel with at least a portion of the movement ofthe substrate P (object) based on the movement conditions of thesubstrate P (object). The controller 6 moves the second member 22 whileperforming the supply of the liquid LQ from the liquid supply part 31and the recovery of the liquid LQ from the fluid recovery part 27 andthe fluid recovery part 24 so that the liquid immersion space LS iscontinuous to be formed.

In the present embodiment, the second member 22 is able to move so thatthe relative movement between the second member 22 and the substrate P(object) is decreased. Moreover, the second member 22 is able to move sothat the relative movement between the second member and the substrate P(object) is smaller than the relative movement between the first member21 and the substrate P (object). For example, the second member 22 maymove in synchronization with the substrate P (object).

The relative movement includes at least one of a relative speed and arelative acceleration. For example, in a state where the liquidimmersion space LS is formed, that is, in a state where the liquid LQ ispresent in the second space SP2, the second member 22 may move so thatthe relative speed between the second member 22 and the substrate P(object) is decreased. Moreover, in the state where the liquid immersionspace LS is formed, that is, in the state where the liquid LQ is presentin the second space SP2, the second member 22 may move so that therelative acceleration between the second member and the substrate P(object) is decreased. In addition, in the state where the liquidimmersion space LS is formed, that is, in the state where the liquid LQis present in the second space SP2, the second member 22 may move sothat the relative speed between the second member and the substrate P(object) is smaller than the relative speed between the first member 21and the substrate P (object). Moreover, in the state where the liquidimmersion space LS is formed, that is, in a state where the liquid LQ ispresent in the second space SP2, the second member 22 may move so thatthe relative acceleration between the second member and the substrate P(object) is smaller than the relative acceleration between the firstmember 21 and the substrate P (object).

For example, the second member 22 is able to move in the movementdirection of the substrate P (object). For example, when the substrate P(object) moves in the +X direction (or the −X direction), the secondmember 22 is able to move in the +X direction (or the −X direction).Moreover, when the substrate P (object) moves in the +Y direction (orthe −Y direction) while moving in the +X direction, the second member 22is able to move in the +X direction. In addition, when the substrate P(object) moves in the +Y direction (or the −Y direction) while moving inthe −X direction, the second member 22 is able to move in the −Xdirection. That is, in the present embodiment, when the substrate P(object) moves in the direction which includes the component of the Xaxis direction, the second member 22 moves in the X axis direction.

For example, the second member 22 may move in the X axis direction inparallel with at least a portion of the movement of the substrate P(object) in the direction including the component in the X axisdirection.

Moreover, the second member 22 may move in the Y axis direction. Whenthe substrate P (object) moves in the direction including the componentin the Y axis direction, the second member 22 may move in the Y axisdirection. For example, the second member 22 may move in the Y axisdirection so that the difference in the relative speed between thesecond member and the substrate P (object) is decreased in parallel withat least a portion of the movement of the substrate P (object) in thedirection including the component in the Y axis direction.

FIG. 9 shows an example of a state where the second member 22 moves.FIG. 9 is a view when the liquid immersion member 5 is viewed from below(−Z side).

In the descriptions below, the second member 22 moves in the X axisdirection. Moreover, as described above, the second member 22 may movein the Y axis direction and may move in an arbitrary direction in the XYplane which includes the component in the X axis direction (or the Yaxis direction).

When the substrate P (object) moves in the X axis direction (or apredetermined direction in the XY plane which includes the component inthe X axis direction), as shown in FIGS. 9(A) to 9(C), the second member22 moves in the X axis direction.

In the present embodiment, the second member 22 is able to move in amovable range which is defined with respect to the X axis direction.FIG. 9(A) shows a state where the second member 22 is disposed at thefurthest end of the −X side of the movable range. FIG. 9(B) shows astate where the second member 22 is disposed at the center of themovable range. FIG. 9(C) shows a state where the second member 22 isdisposed at the furthest end of the +X side of the movable end.

In the descriptions below, the position of the second member 22 shown inFIG. 9(A) is appropriately referred to as a first end part position, theposition of the second member 22 shown in FIG. 9(B) is appropriatelyreferred to as a center position, and the position of the second member22 shown in FIG. 9(C) is appropriately referred to as a second end partposition. Moreover, as shown in FIG. 9(B), the state where the secondmember 22 is disposed at the center position includes the state wherethe second member 22 is disposed at the origin.

In the present embodiment, the size of the opening 35 is determinedbased on the size of the movable range of the second member 22 so thatthe exposure light EL from the emitting surface 12 passes through theopening 35. The size of the movable range of the second member 22includes the distance between the first end part position and the secondend part position with respect to the X axis direction. The size in theX axis direction of the opening 35 is determined so that, even when thesecond member 22 moves in the X axis direction, the exposure light ELfrom the emitting surface 12 is not radiated to the second member 22.

In FIG. 9, the size W35 of the opening 35 with respect to the X axisdirection is larger than the sum of the size Wpr of the exposure lightEL (projection region PR) and the size (Wa+Wb) of the movable range ofthe second member 22. The size W35 is determined as the size in which,even when the second member 22 moves between the first end part positionand the second end part position, the exposure light EL from theemitting surface 12 is not blocked. Accordingly, even when the secondmember 22 moves, the exposure light EL from the emitting surface 12 isnot blocked by the second member 22 and can be radiated to the substrateP (object).

Next, an example of a supporting apparatus 50 which supports the liquidimmersion member 5 will be described. FIGS. 10 and 11 are side viewsshowing examples of the liquid immersion member 5 and the supportingapparatus 50 according to the present embodiment. FIGS. 12 and 13 areplan views showing examples of the liquid immersion member 5 and thesupporting apparatus 50 according to the present embodiment.

FIG. 10 is a view when viewed from the −Y side, and FIG. 11 is a viewwhen viewed from the +X side. FIG. 12 is a view when viewed from the +Zside, and FIG. 13 is a view when viewed from the −Z side.

In the present embodiment, the supporting apparatus 50 includes a firstsupporting member 51 which supports the first member 21 and a secondsupporting member 52 which supports the second member 22. In addition,the supporting apparatus 50 includes a support frame 53 which supportsthe first supporting member 51 and a moving frame 54 which supports thesecond supporting member 52.

The first supporting member 51 is connected to the first member 21. Thefirst member 21 is fixed to the first supporting member 51. The firstsupporting member 51 is disposed to surround the first member 21. Thefirst supporting member 51 includes an upper surface 51A facing the +Zdirection and a lower surface 51B facing the −Z direction.

The support frame 53 is connected to the first supporting member 51. Thefirst supporting member 51 is fixed to the support frame 53. The supportframe 53 supports the first member 21 via the first supporting member51.

The second supporting member 52 is connected to the second member 22.The second member 22 is fixed to the second supporting member 52. In thepresent embodiment, the second supporting member 52 is connected to aportion of the second member 22 of the +Y side with respect to thecenter of the opening 35. The second supporting member 52 is connectedto the second member 22 outside the first member 21 with respect to theoptical path K. The second supporting member 52 includes an uppersurface 52A facing the +Z direction and a lower surface 52B facing the−Z direction.

The moving frame 54 is connected to the second supporting member 52. Thesecond supporting member 52 is fixed to the moving frame 54. The movingframe 54 supports the second member 22 via the second supporting member52.

In the present embodiment, the first member 21 and the second member 22do not contact each other. The first supporting member 51 and the secondsupporting member 52 do not contact each other. The lower surface 51B ofthe first supporting member 51 is opposite to the upper surface 52A ofthe second supporting member 52 via a gap.

The supporting apparatus 50 includes a prevention apparatus 55 whichsuppresses vibration of the first member 21. For example, the vibrationisolator 55 suppresses the vibration of the first member 21 caused bythe movement of the second member 22. The vibration isolator 55 iscontrolled by the controller 6.

At least a portion of the vibration isolator 55 is supported by theapparatus frame 8B. At least a portion of the vibration isolator 55 isdisposed between the support frame 53 and the apparatus frame 8B. Atleast a portion of the vibration isolator 55 is disposed below thesupport frame 53. A lower surface 53B of the support frame 53, whichfaces the −Z direction, is opposite to the vibration isolator 55. Atleast a portion of the vibration isolator 55 is opposite to an uppersurface 8Ba of the apparatus frame 8B which faces the +Z direction.

The vibration isolator 55 is disposed at each of the +X side and the −Xside with respect to the optical axis of the terminal optical element13. The support frame 53 is long in the X axis direction. The vibrationisolator 55 is connected to each of the +X side end part and the −X sideend part of the support frame 53.

Moreover, the vibration isolator 55 may be disposed at one location, andmay be disposed at each of the plurality of positions such as three ormore locations.

In the present embodiment, the vibration isolator 55 suppresses thevibration of the support frame 53, and suppresses the vibration of thefirst member 21 which is supported by the support frame 53.

For example, the vibration isolator 55 includes a plurality ofactuators. The vibration isolator 55 suppresses the vibration of thefirst member 21 by operations of the actuators. That is, the vibrationisolator 55 is a so-called active type vibration isolator. Moreover, thevibration isolator 55 may include a damping apparatus (damper) inaddition to the actuators. For example, the vibration isolator 55 mayinclude six piezo actuators. The vibration isolator 55 may use sixactuators, and the first member 21 (support frame 53) may be moved insix directions of the X axis, the Y axis, the Z axis, the θX, the θY,and the θZ. That is, the vibration isolator 55 may be an active typevibration isolator having six degrees of freedom.

Moreover, the vibration isolator 55 operates the actuator and is able tomove the first member 21.

That is, the vibration isolator 55 functions as a driving apparatuswhich is able to move the first member 21. The vibration isolator 55 isable to move the first member 21 with respect to a reference member. Thevibration isolator 55 is able to move the first member 21 in sixdirections of the X axis, the Y axis, the Z axis, the θX, the θY, andthe θZ.

The vibration isolator 55 is able to move the first member 21 so thatdisplacement of the first member 21 with respect to the reference memberis suppressed. For example, the vibration isolator 55 moves the firstmember 21 so that the displacement of the first member 21 caused by themovement of the second member 22 is suppressed.

The vibration isolator 55 is able to move the first member 21 so thatthe displacement of the first member 21 with respect to the terminaloptical element 13 is suppressed. The vibration isolator 55 is able tomove the first member 21 so that a relative position between theterminal optical element 13 and the first member 21 is not changed.

In addition, the reference member is not limited to the terminal opticalelement 13. The reference member may be a member in which the positionis not substantially changed in the exposure apparatus EX. For example,the vibration isolator 55 may move the first member 21 so that thedisplacement of the first member 21 with respect to the reference frame8A is suppressed.

The vibration isolator 55 may move the first member 21 so that thedisplacement of the first member 21 with respect to a holding member(barrel or the like) which holds optical elements of the projectionoptical system PL is suppressed.

In the present embodiment, a detection apparatus 62 which is able todetect the position of the first member 21 is provided. The detectionapparatus 62 is able to detect the position of the first member 21 withrespect to the reference member. In the present embodiment, thedetection apparatus 62 is able to detect the position of the firstmember 21 with respect to the terminal optical element 13. In thepresent embodiment, the detection apparatus 62 is able to detect theposition (the position with respect to the terminal optical element 13)of the first member 21 with respect to each of six directions of the Xaxis, the Y axis, the Z axis, the θX, the θY, and the θZ. At least aportion of the detection apparatus 62 may be disposed at the firstmember 21. Moreover, at least a portion of the detection apparatus 62may be disposed at the first supporting member 51, and may be disposedat the support frame 53. In addition, at least a portion of thedetection apparatus 62 may be disposed at the terminal optical element13. Moreover, at least a portion of the detection apparatus 62 may bedisposed at the holding member which holds the terminal optical element13. In the present embodiment, the detection apparatus 62 includes aninterferometer system. The detection apparatus 62 includes a laserinterferometer which is disposed at the first member 21 and includes alight emitting portion and a light receiving portion of a laser light,and a reflection member which is disposed at the terminal opticalelement 13 (reference member). The laser interferometer may be disposedat the first supporting member 51 and may be disposed at the supportframe 53. The reflection member may be disposed at at least one of thereference frame 8A and the holding members which hold the opticalelements of the projection optical system PL. The laser light which isemitted from the light emitting portion of the laser interferometer isradiated to the reflection member. The light receiving portion of thelaser interferometer detects at least a portion of the laser light whichis reflected by the reflection member. For example, the detectionapparatus 62 may detect the position of the first member 21 with respectto the reference frame 8A. The detection result of the detectionapparatus 62 is output to the controller 6.

The controller 6 is able to obtain the position of the first member 21with respect to the terminal optical element 13 based on the detectionresult of the detection apparatus 62. Moreover, the controller 6 is ableto obtain a displacement amount of the first member 21 with respect tothe terminal optical element 13 based on the detection result of thedetection apparatus 62. In addition, the controller 6 is able to obtainthe relative position between the terminal optical element 13 and thefirst member 21 based on the detection result of the detection apparatus62.

Moreover, the controller 6 is able to obtain the size of the gap (thesize of the third space SP3) between the terminal optical element 13 andthe first member 21 based on the detection result of the detectionapparatus 62.

In addition, the controller 6 is able to obtain the size of the gap (thesize of the second space SP2) between the first member 21 and the object(the substrate P, the substrate stage 2, the measurement stage 3, or thelike) based on the detection result of the detection apparatus 62.Moreover, the controller 6 may obtain the size of the gap between thefirst member 21 and the object based on the detection result of adetection system (a so-called focus leveling detection system) which isable to detect a position of the upper surface of the object, and thedetection result of the detection apparatus 62.

For example, the controller 6 is able to control the vibration isolator55 based on the detection result of the detection apparatus 62 so thatthe displacement of the first member 21 with respect to the terminaloptical element 13 (reference member) is suppressed.

The controller 6 may control the vibration isolator 55 based on thedetection result of the detection apparatus 62 so that the displacementamount of the first member 21 with respect to the terminal opticalelement 13 (reference member) is within a target range (allowablerange). For example, the controller 6 may control the vibration isolator55 so that the detection value of the detection apparatus 62 is smallerthan the target value.

In the present embodiment, the detection apparatus 62 is able to detectthe position (the position with respect to the reference member) of thefirst member 21 with respect to each of six directions of the X axis,the Y axis, the Z axis, the θX, the OY, and the θZ. The vibrationisolator 55 is able to move the first member 21 in each of sixdirections of the X axis, the Y axis, the Z axis, the θX, the θY, andthe θZ. In the present embodiment, a position adjustment system havingsix inputs and six outputs is provided to adjust the position of thefirst member 21 with respect to six directions.

The controller 6 is able to control the vibration isolator 55 so thatthe displacement amount of the first member 21 with respect to at leastone direction of six directions is within the target range.

In addition, the controller 6 may adjust the position of the firstmember 21 by using the vibration isolator 55 so that a change amount ofthe relative position between the terminal optical element 13 and thefirst member 21 is smaller than the target value. Moreover, thecontroller 6 may suppress the displacement of the first member 21 withrespect to the terminal optical element 13 by using the vibrationisolator 55 so that the size of the gap (the size of the third spaceSP3) between the terminal optical element 13 and the first member 21 iswithin the target range. The controller 6 may adjust the position of thefirst member 21 by controlling the vibration isolator 55 so that adifference between the detection value of the size of the gap (the sizeof the third space SP3) between the terminal optical element 13 and thefirst member 21 which is detected using the detection apparatus 62, andthe target value is decreased. The controller 6 may control theoperation (moving mode) of the first member 21 by using the vibrationisolator 55 so that a displacement rate (moving speed) of the firstmember 21 with respect to the terminal optical element 13 is smallerthan the target speed. For example, the controller 6 may control theoperation of the first member 21 so that the relative speed between theterminal optical element 13 and the first member 21 in the Z axisdirection is smaller than the target speed. The controller 6 may controlthe operation of the first member 21 so that the change amount of thedimensions (size and volume) of the third space SP3 per unit time issmaller than the target value.

Moreover, the controller 6 may adjust the position of the first member21 using the vibration isolator 55 so that the change amount of therelative position between the object (at least one of the substrate P,the substrate stage 2, and the measurement stage 3) and the first member21 is smaller than the target value. In addition, the controller 6 maysuppress the displacement of the first member 21 by using the vibrationisolator 55 so that the size of the gap (the size of the second spacePS2) between the first member 21 and the object is within the targetrange. The controller 6 may adjust the position of the first member 21by controlling the vibration isolator 55 so that a difference betweenthe detection value of the size of the gap (the size of the second spaceSP2) between the first member 21 and the object detected using thedetection apparatus 62 and the target value is decreased. The controller6 may control the operation (moving mode) of the first member 21 usingthe vibration isolator 55 so that a displacement rate (moving speed) ofthe first member 21 with respect to the object is smaller than thetarget speed. For example, the controller 6 may control the operation ofthe first member 21 so that the relative speed between the object andthe first member 21 in the Z axis direction is smaller than the targetspeed. The controller 6 may control the operation of the first member 21so that the change amount of the dimensions (size and volume) of thesecond space SP2 per unit time is smaller than the target value.

In the present embodiment, a detection apparatus 63 which is able todetect the acceleration of the first member 21 is provided.

In the present embodiment, the detection apparatus 63 is able to detectthe acceleration of the first member 21 with respect to each of sixdirections of the X axis, the Y axis, the Z axis, the θX, the θY, andthe θZ. In the present embodiment, at least a portion of the detectionapparatus 63 may be disposed at the first member 21. Moreover, at leasta portion of the detection apparatus 63 may be disposed at the firstsupporting member 51, and may be disposed at the support frame 53. Thedetection result of the detection apparatus 63 is output to thecontroller 6.

For example, the controller 6 is able to control the vibration isolator55 based on the detection result of the detection apparatus 63 so thatthe vibration of the first member 21 is suppressed. In the presentembodiment, the controller 6 may control the vibration isolator 55 sothat the detection value of the detection apparatus 63 is smaller thanthe target value.

In the present embodiment, the detection apparatus 63 is able to detectthe acceleration of the first member 21 with respect to each of sixdirections of the X axis, the Y axis, the Z axis, the θX, the θY, andthe θZ. The vibration isolator 55 is able to move the first member 21 ineach of six directions of the X axis, the Y axis, the Z axis, the θX,the θY, and the θZ. In the present embodiment, a vibration isolationsystem having six inputs and six outputs is provided to suppress thevibration of the first member 21 with respect to six directions. Thecontroller 6 is able to control the vibration isolator 55 so that thevibration (acceleration) of the first member 21 with respect to at leastone direction of six directions is within the target range.

In addition, the controller 6 may control the operation of the firstmember 21 so that the relative acceleration between the terminal opticalelement 13 and the first member 21 with respect to the Z axis directionis smaller than the target acceleration.

Moreover, in the present embodiment, the controller 6 may adjust theposition of the first member 21, may suppress the displacement of thefirst member 21 with respect to the terminal optical element 13, and maysuppress the vibration of the first member 21 by using the vibrationisolator 55 so that a pressure change of the third space SP3 issuppressed. For example, when a pressure sensor which is able to detectthe pressure of the third space SP3 is provided, the controller 6 maycontrol the vibration isolator 55 based on the detection result of thepressure sensor so that the pressure change of the third space SP3 issuppressed.

Moreover, in the present embodiment, the controller 6 may adjust theposition of the first member 21, may suppress the displacement of thefirst member 21 with respect to the object (substrate P or the like),and may suppress the vibration of the first member 21 by using thevibration isolator 55 so that the pressure change of the second spaceSP2 is suppressed. For example, when a pressure sensor which is able todetect the pressure of the second space SP2 is provided, the controller6 may control the vibration isolator 55 based on the detection result ofthe pressure sensor so that the pressure change of the second space SP2is suppressed.

In the present embodiment, the supporting apparatus 50 includes adriving apparatus 56 which moves the second member 22. The second member22 is moved by the driving apparatus 56. For example, the drivingapparatus 56 includes a motor, and is able to move the second member 22using Lorentz force. The driving apparatus 56 is able to move the secondmember 22 with respect to the first member 21. The driving apparatus 56is controlled by the controller 6.

In the present embodiment, at least a portion of the driving apparatus56 is supported by the apparatus frame 8B. At least a portion of thedriving apparatus 56 is disposed on the apparatus frame 8B. The uppersurface 8Ba of the apparatus frame 8B facing the +Z direction isopposite to the driving apparatus 56.

The moving frame 54 supports the second member 22 via the secondsupporting member 52. In the present embodiment, the driving apparatus56 moves the moving frame 54. The moving frame 54 is moved by thedriving apparatus 56, and thus, the second supporting member 52 ismoved. The second supporting member 52 is moved by the driving apparatus56, and thus, the second member 22 is moved.

In the present embodiment, the support frame 53 is supported by theapparatus frame 8B. The support frame 53 is supported by the apparatusframe 8B via the vibration isolator 55. The vibration isolator 55supports the first member 21 via the support frame 53 and the firstsupporting member 51. The first member 21 is supported by the vibrationisolator 55 via the first supporting member 51 and the support frame 53.The apparatus frame 8B supports the first member 21 via the vibrationisolator 55, the support frame 53, and the first supporting member 51.

In the present embodiment, the moving frame 54 is supported by theapparatus frame 8B. The moving frame 54 is supported by the apparatusframe 8B via the driving apparatus 56. The driving apparatus 56 supportsthe second member 22 via the moving frame 54 and the second supportingmember 52. The second member 22 is supported by the driving apparatus 56via the second supporting member 52 and the moving frame 54. Theapparatus frame 8B supports the second member 22 via the drivingapparatus 56, the moving frame 54, and the second supporting member 52.

In the present embodiment, the apparatus frame 8B supports the referenceframe 8A which supports the projection optical system PL (terminaloptical element 13), the support frame 53 (vibration isolator 55) whichsupports the first member 21, and the moving frame 54 (driving apparatus56) which supports the second member 22.

Moreover, in the present embodiment, the first supporting member 51 maybe a portion of the first member 21. In addition, in the presentembodiment, the second supporting member 52 may be a portion of thesecond member 22.

In the present embodiment, the driving apparatus 56 is disposed at the−X side with respect to the optical axis of the terminal optical element13. In the present embodiment, the moving frame 54 is a rod member whichis long in the X axis direction.

In the present embodiment, the driving apparatus 56 is connected to the−X side end part of the moving frame 54. The second supporting member 52is connected to the +X side end part of the moving frame 54.

Moreover, in the present embodiment, the moving frame 54 may include aplurality of members. For example, the moving frame 54 may include afirst rod member which is connected to the driving apparatus 56, asecond rod member which is connected to the second supporting member 52,and a link mechanism (a hinge mechanism) which is disposed between thefirst rod member and the second rod member. In addition, the movingframe 54 may include a rod member, and a link mechanism (hingemechanism) which connects the rod member, one end of the rod member andthe driving apparatus 56. Moreover, the moving frame 54 may include therod member, and a link mechanism (hinge mechanism) which connects theother end of the rod member and the second supporting member 52. Atleast a portion of the moving frame 54 may be flexible.

Moreover, a plurality of moving frames 54 may be connected to the secondsupporting member 52. The driving apparatus 56 may be connected to eachof the plurality of moving frames 54. A plurality of driving apparatuses56 may be provided.

The supporting apparatus 50 includes a guide apparatus 57 which guidesthe second member 22. In the present embodiment, the guide apparatus 57guides the second member 22 in the X axis direction. In the presentembodiment, at least a portion of the guide apparatus 57 is disposedbetween the first supporting member 51 (first member 21) and the secondsupporting member 52 (second member 22).

The second member 22 is guided in the X axis direction by the guideapparatus 57. In the present embodiment, the movement of the secondmember 22 with respect to the directions of the Y axis, the Z axis, theθX, the θY, and the θZ is limited.

The guide apparatus 57 includes a gas bearing 57G between the lowersurface 51B of the first supporting member 51 and the upper surface 52Aof the second supporting member 52. In the present embodiment, the guideapparatus 57 includes a so-called air guide mechanism. For example, thegas bearing 57G includes a gas supply port which is disposed at thelower surface 51B and a gas discharge port which is disposed at thelower surface 51B. In addition, the gas supply port may be disposed atthe upper surface 52A. The gas discharge port may be disposed at theupper surface 52A. By the gas bearing 57G, the second supporting member22 (second member 22) is supported in a non-contact manner by the firstsupporting member 21 (first member 21).

By the gas bearing 57G, the second supporting member 22 (second member22) is guided in the X axis direction in a non-contact state withrespect to the first supporting member 21 (first member 21).

In addition, in the present embodiment, at least a portion of the secondsupporting member 52 may be opposite to the support frame 53. The guideapparatus 57 may be disposed between the second supporting member 52 andthe support frame 53.

FIG. 14 is a view schematically showing an example of the drivingapparatus 56 according to the present embodiment. FIG. 15 is across-sectional view taken along the A-A line of FIG. 14.

In the present embodiment, for example, the driving apparatus 56includes an actuator which is operated by Lorentz force such as a linearmotor or a voice coil motor. In the present embodiment, the drivingapparatus 56 is able to move the second member 22 in at least the X axisdirection.

In FIGS. 14 and 15, the driving apparatus 56 includes a stator 57 and amover 58. The stator 57 is disposed at the apparatus frame 8B. The mover58 is disposed at the moving frame 54. The mover 58 is connected to thesecond supporting member 52 (second member 22) via the moving frame 54.

The mover 58 is able to move in the X axis direction with respect to thestator 57. The mover 58 moves in the X axis direction, and thus, thesecond supporting member 52 (second member 22) connected to the mover 58via the moving frame 54 moves in the X axis direction. The secondsupporting member 52 (second member 22) is moved in a state where thesecond supporting member 52 (second member 22) and the first supportingmember 51 (first member 21) are at least partially opposite to eachother via a gap.

In the present embodiment, the stator 57 is supported in a non-contactmanner by the apparatus frame 8B. In the present embodiment, a gasbearing 59 is provided between the stator 57 and the apparatus frame 8B.By the gas bearing 59, the stator 57 is supported in a non-contactmanner by the apparatus frame 8B.

In the present embodiment, the stator 57 moves in the −X direction bythe movement in the +X direction of the mover 58. Moreover, by themovement in the −X direction of the mover 58, the stator 57 moves in the+X direction. That is, the stator 57 moves in the −X direction (+Xdirection) in at least a part of a period in which the mover 58 moves inthe +X direction (−X direction).

By the movement of the stator 57, a reaction force which is caused bythe movement of the mover 58 (the moving frame 54, the second supportingmember 52, the second member 22) is cancelled, and a change of a gravitycenter position is suppressed. In the present embodiment, the stator 57functions as a so-called counter mass.

In the present embodiment, since the stator 57 functions as the countermass, even when the mover 58 moves in the X axis direction, occurrenceof the vibration is suppressed.

In the present embodiment, the driving apparatus 56 includes a positionadjustment apparatus 60 which adjust the position of the moving stator57. In the present embodiment, the position adjustment apparatus 60includes a damper using an electromagnetic force (a so-calledelectromagnetic damper). The electromagnetic damper is able to adjust adamping force (damping force characteristics).

Moreover, the position adjustment apparatus 60 may include a spring. Bythe position adjustment apparatus 60, for example, the moving stator 57is returned to an initial position (an origin).

In the present embodiment, the driving apparatus 56 includes a positionsensor 61 which detects positions of the stator 57 and the mover 58. Theposition sensor 61 includes a first sensor 61A which detects theposition of the stator 57 and a second sensor 61B which detects theposition of the mover 58. In the present embodiment, each of the firstsensor 61A and the second sensor 61B includes an encoder. The firstsensor 61A includes a scale member 61Aa which is disposed at the stator57, and an encoder head 61Ab which detects the scale of the scale member61Aa. The second sensor 61B includes a scale member 61Ba which isdisposed at the mover 58, and an encoder head 61Bb which detects thescale of the scale member 61Ba. The positions of the encoder head 61Abof the first sensor 61A and the encoder head 61Bb of the second sensor61B are fixed.

The detection result of the position sensor 61 (first and second sensors61A and 61B) are output to the controller 6. The controller 6 is able toobtain at least one of the position of the stator 57 (the position ofthe first sensor 61A with respect to the encoder head 61Ab), theposition of the mover 58 (the position of the second sensor 61B withrespect to the encoder head 61Bb), and a relative position between thestator 57 and the mover 58, based on the detection result of theposition sensor 61. The controller 6 is able to control the drivingapparatus 56 based on the detection result of the position sensor 61 sothat the second member 22 is disposed at a desired position (theposition in the X axis direction). Moreover, the controller 6 is able tocontrol the driving apparatus 56 based on the detection result of theposition sensor 61 so that the second member 22 moves within a desiredmovement range.

In addition, the controller 6 is able to control the driving apparatus56 based on the detection result of the position sensor 61 so that thesecond member 22 moves at a desired speed. Moreover, the controller 6 isable to control the driving apparatus 56 based on the detection resultof the position sensor 61 so that the second member 22 moves at adesired acceleration.

In addition, when the speed of the second member 22 is controlled, thecontroller 6 acquires speed information by calculation processing withrespect to the detection value of the position sensor 61 and may controlthe speed of the second member 22 based on the speed information.Moreover, other than the position sensor 61, a speed sensor which isable to detect the speed of the second member 22 may be provided, andthe speed of the second member 22 may be controlled based on thedetection result of the speed sensor.

In addition, when the acceleration of the second member 22 iscontrolled, the controller 6 may acquire acceleration information bycalculation processing with respect to the detection value of theposition sensor 61 and may control the acceleration of the second member22 based on the acceleration information. Moreover, other than theposition sensor 61, an acceleration sensor which is able to detect theacceleration of the second member 22 may be provided, and theacceleration of the second member 22 may be controlled based on thedetection result of the acceleration sensor.

Next, a method of exposing the substrate P using the exposure apparatusEX including the above-described configuration will be described.

In a substrate exchange position away from the liquid immersion member5, processing which carries (loads) the substrate P before the exposureto the substrate stage 2 (first holding portion) is performed. Moreover,in at least a part of a period in which the substrate stage 2 is awayfrom the liquid immersion member 5, the measurement stage 3 is disposedto be opposite to the terminal optical element 13 and the liquidimmersion member 5. The controller 6 performs the supply of the liquidLQ from the liquid supply part 31 and the recovery of the liquid LQ fromthe fluid recovery part 27, and the liquid immersion space LS is formedat the measurement stage 3.

After the substrate P before the exposure is loaded on the substratestage 2 and the measurement processing using the measurement stage 3 isterminated, the controller 6 moves the substrate stage 2 so that theterminal optical element 13 and the liquid immersion member 5 areopposite to the substrate stage 2 (substrate P). In the state where theterminal optical element 13 and the liquid immersion member 5 areopposite to the substrate stage 2 (substrate P), the recovery of theliquid LQ from the fluid recovery part 27 is performed in parallel withthe supply of the liquid LQ from the liquid supply part 31, and thus,the liquid immersion space LS is formed between the terminal opticalelement 13 and the liquid immersion member 5, and the substrate stage 2(substrate P) so that the optical path K is filled with the liquid LQ.

In the present embodiment, the recovery of the liquid LQ from the fluidrecovery part 24 is performed in parallel with the supply of the liquidLQ from the liquid supply part 31 and the recovery of the liquid LQ fromthe fluid recovery part 27.

The controller 6 starts the exposure processing of the substrate P. Inthe state where the liquid immersion space LS is formed on the substrateP, the controller 6 emits the exposure light EL from the illuminationsystem IL. The illumination system IL illuminates the mask M with theexposure light EL. The exposure light EL from the mask M is radiated tothe substrate P via the liquid LQ in the liquid immersion space LSbetween the projection optical system PL and the emitting surface 12,and the substrate P. Accordingly, the substrate P is exposed by theexposure light EL which is emitted from the emitting surface 12 via theliquid LQ in the liquid immersion space LS between the emitting surface12 of the terminal optical element 13 and the substrate P, and the imageof the pattern of the mask M is projected to the substrate P.

The exposure apparatus EX of the present embodiment is a scanning typeexposure apparatus (a so-called scanning stepper) in which the mask Mand the substrate P synchronously move in a predetermined scanningdirection and the image of the pattern of the mask M is projected to thesubstrate P. In the present embodiment, the scanning direction of thesubstrate P (synchronous movement direction) is set to the Y axisdirection, and the scanning direction (synchronous movement direction)of the mask M is also set to the Y axis direction. The controller 6radiates the exposure light EL to the substrate P via the projectionoptical system PL and the liquid LQ in the liquid immersion space LS onthe substrate P while moving the substrate P in the Y axis directionwith respect to the projection region PR of the projection opticalsystem PL and moving the mask M in the Y axis direction with respect tothe illumination region IR of the illumination system IL insynchronization with the movement in the Y axis direction of thesubstrate P.

FIG. 16 is a view showing an example of the substrate P which is held bythe substrate stage 2. In the present embodiment, a plurality of shotregions S, which are regions to be exposed on the substrate P, arearranged in a matrix form.

The controller 6 sequentially exposes the plurality of shot regions S ofthe substrate P by the exposure light EL emitted from the emittingsurface 12 via the liquid LQ in the liquid immersion space LS betweenthe emitting surface 12 and the substrate P while moving the substrate Pheld by the first holding portion in the Y axis direction (scanningdirection) with respect to the exposure light EL emitted from theemitting surface 12 of the terminal optical element 13.

For example, in order to expose one shot region S of the substrate P, inthe state where the liquid immersion space LS is formed, the controller6 radiates the exposure light EL to the shot region S via the projectionoptical system PL and the liquid LQ in the liquid immersion space LS onthe substrate P while moving the substrate P in the Y axis directionwith respect to the exposure light EL emitted from the emitting surface12 (the projection region PR of the projection optical system PL), andmoving the mask M in the Y axis direction with respect to theillumination region IR of the illumination system IL in synchronizationwith the movement in the Y axis direction of the substrate P.Accordingly, the image of the pattern of the mask M is projected to theshot region S, and the shot region S is exposed by the exposure light ELwhich is emitted from the emitting surface 12.

After the exposure of the shot region S is terminated, in order to startthe exposure of a next shot region S, in the state where the liquidimmersion space LS is formed, the controller 6 moves the substrate P inthe direction (for example, X axis direction, directions which areinclined with respect to the X axis direction and Y axis direction inthe XY plane, or the like) which intersects the Y axis in the XY plane,and moves the next shot region S to an exposure starting position.Thereafter, the controller 6 starts the exposure of the shot region S.

The controller 6 repeats the operation which exposes the shot regionwhile moving the shot region in the Y axis direction with respect to theposition (projection region PR) radiated with the exposure light EL fromthe emitting surface 12 in the state where the liquid immersion space LSis formed above the substrate P (substrate stage 2), and after theexposure of the shot region, the operation which moves the substrate Pin the direction (for example, X axis direction, directions which areinclined with respect to the X axis direction and Y axis direction inthe XY plane, or the like) which intersects the Y axis direction in theXY plane so that the next shot region is disposed at the exposure startposition in the state where the liquid immersion space LS is formed onthe substrate P (substrate stage 2), and the controller sequentiallyexposes each of the plurality of shot regions of the substrate P.

In the descriptions below, the operation, which moves the substrate P(shot region) in the Y axis direction with respect to the position(projection region PR) radiated with the exposure light EL from theemitting surface 12 in a state where the liquid immersion space LS isformed above the substrate P (substrate stage 2) in order to expose theshot region, is appropriately referred to as a scan movement operation.Moreover, the operation, which moves the substrate P in the XY planebefore the exposure of the next shot region starts in the state wherethe liquid immersion space LS is formed on the substrate P (substratestage 2) after the exposure of a predetermined shot region isterminated, is appropriately referred to as a step movement operation.

In the present embodiment, the scan movement operation includes anoperation in which the substrate P moves in the Y axis direction from astate where a predetermined shot region S is placed at the exposurestarting position to a state where the predetermined shot region isplaced at the exposure termination position. The step movement operationincludes an operation in which the substrate P moves in a directionintersecting the Y axis direction in the XY plane from a state where apredetermined shot region S is placed at the exposure terminationposition to a state where the next shot region S is placed at theexposure starting position.

The exposure starting position includes a position of the substrate Pwhen one end in the Y axis direction of a predetermined shot region Spasses through the projection region PR in order to expose the shotregion S. The exposure termination position includes a position of thesubstrate P when the other end in the Y axis direction of the shotregion S, which was radiated by the exposure light EL, passes throughthe projection region PR.

The exposure starting position of the shot region S includes a startingposition of the scan movement operation in order to expose the shotregion S. The exposure starting position of the shot region S includes atermination position of the step movement operation in order to disposethe shot region S at the exposure starting position.

The exposure termination position of the shot region S includes atermination position of the scan movement operation in order to exposethe shot region S. The exposure termination position of the shot regionS includes a starting position of the step movement operation in orderto place the next shot region S at the exposure starting position afterthe exposure of the shot region S is terminated.

In the descriptions below, a period, in which the scan movementoperation is performed in order to expose a predetermined shot region S,is appropriately referred to as a scan movement period. In thedescriptions below, a period, in which the step movement operation isperformed in order to start the exposure of the next shot region S afterthe exposure termination of a predetermined shot region S, isappropriately referred to as a step movement period.

The scan movement period includes the exposure period from the exposurestart of a predetermined shot region S to the exposure termination. Thestep movement period includes a movement period of the substrate P fromthe exposure termination of a predetermined shot region S to theexposure start of the next shot region S.

In the scan movement operation, the exposure light EL is emitted fromthe emitting surface 12. In the scan movement operation, the exposurelight EL is radiated to the substrate P (object). In the step movementoperation, the exposure light EL is not emitted from the emittingsurface 12. In the step movement operation, the exposure light EL is notradiated to the substrate P (object).

The controller 6 sequentially exposes each of the plurality of shotregions S of the substrate P while repeating the scan movement operationand the step movement operation. Moreover, the scan movement operationis an equal speed movement mainly with respect to the Y axis direction.The step movement operation includes acceleration and decelerationmovement. For example, the step movement operation between from theexposure termination of a predetermined shot region S to the exposurestart of the next shot region S includes one or both of the accelerationand deceleration movement with respect to the Y axis direction and theacceleration and deceleration movement with respect to the X axisdirection.

Moreover, there is a case where at least a portion of the liquidimmersion space LS may be formed above the substrate stage 2 (covermember T) in at least a portion of the scan movement operation and thestep movement operation. There is a case where the liquid immersionspace LS may be formed over the substrate P and the substrate stage 2(cover member T) in at least a part of the scan movement operation andthe step movement operation. When the exposure of the substrate P isperformed in a state where the substrate stage 2 and the measurementstage 3 approach or contact each other, there is a case where the liquidimmersion space LS may be formed over the substrate stage 2 (covermember T) and the measurement stage 3 in at least a part of the scanmovement operation and the step movement operation.

The controller 6 controls the driving system 15 based on exposureconditions of the plurality of shot regions S on the substrate P andmoves the substrate P (substrate stage 2). For example, the exposureconditions of the plurality of shot regions S are defined by exposurecontrol information referred to as an exposure recipe. The exposurecontrol information is stored in the storage apparatus 7.

The exposure conditions (exposure control information) include aplurality of arrangement information of the shot region S (the positionof each of the plurality of shot regions S in the substrate P).Moreover, the exposure conditions (exposure control information) includesize information (size information with respect to the Y axis direction)of each of the plurality of shot regions S.

The controller 6 sequentially exposes each of the plurality of shotregions S while moving the substrate P by a predetermined movementcondition based on the exposure conditions (exposure controlinformation) stored in the storage apparatus 7. The movement conditionsof the substrate P (object) include at least one of the movement speed,the acceleration, the movement distance, the movement direction, and themovement locus in the XY plane.

As an example, when each of the plurality of shot regions S aresequentially exposed, the controller 6 radiates the exposure light EL tothe projection region PR while moving the substrate stage 2 so that theprojection region PR of the projection optical system PL and thesubstrate P relatively move along a movement locus shown by an arrow Srin FIG. 16, and sequentially exposes each of the plurality of shotregions S via the liquid LQ by the exposure light EL. The controller 6sequentially exposes each of the plurality of shot regions S whilerepeating the scan movement operation and the step movement operation.

In the present embodiment, the second member 22 moves in at least aportion of the exposure processing of the substrate P. For example, thesecond member 22 moves in parallel with at least a portion of the stepmovement operation of the substrate P (substrate stage 2) in the statewhere the liquid immersion space LS is formed. For example, the secondmember 22 moves in parallel with at least a portion of the scan movementoperation of the substrate P (substrate stage 2) in the state where theliquid immersion space LS is formed. The exposure light EL is emittedfrom the emitting surface 12 in parallel with the movement of the secondmember 22. In addition, the second member 22 may not move during thescan movement operation. That is, the second member 22 may not move inparallel with the emission of the exposure light EL from the emittingsurface 12. For example, the second member 22 may move so that therelative movement (relative speed, relative acceleration) between thesecond member and the substrate P (substrate stage 2) is decreased whenthe substrate P (substrate stage 2) performs the step movementoperation. In addition, the second member 22 may move so that therelative movement (relative speed, relative acceleration) between thesecond member and the substrate P (substrate stage 2) is decreased whenthe substrate P (substrate stage 2) performs the scan movementoperation.

FIG. 17 is a view schematically showing an example of the movement locusof the substrate P when sequentially exposing each of a shot region Sa,a shot region Sb, and a shot region Sc while performing the stepmovement which includes the components in the +X direction on thesubstrate P. The shot regions Sa, Sb, and Sc are disposed in the X axisdirection.

As shown in FIG. 17, when the shot regions Sa, Sb, and Sc are exposed,the substrate P sequentially moves a pathway Tp1 from a position d1 to aposition d2 adjacent at the +Y side with respect to the position d1, apathway Tp2 from the position d2 to a position d3 adjacent at the +Xside with respect to the position d2, a pathway Tp3 from the position d3to a position d4 adjacent at the −Y side with respect to the positiond3, a pathway Tp4 from the position d4 to a position d5 adjacent at the+X side with respect to the position d4, and a pathway Tp5 from theposition d5 to a position d6 adjacent at the +Y side with respect to theposition d5, under the terminal optical element 13. The positions d1,d2, d3, d4, d5, and d6 are positions in the XY plane.

At least a portion of the pathway Tp1 is a straight line parallel to theY axis. At least a portion of the pathway Tp3 is a straight lineparallel to the Y axis. At least a portion of the pathway Tp5 is astraight line parallel to the Y axis. The pathway Tp2 includes a curvedline passing through a position d2.5. The pathway Tp4 includes a curvedline passing through a position d4.5. The position d1 includes the startpoint of the pathway Tp1, and the position d2 includes the end point ofthe pathway Tp1. The position d2 includes the start point of the pathwayTp2, and the position d3 includes the end point of the pathway Tp2. Theposition d3 includes the start point of the pathway Tp3, and theposition d4 includes the end point of the pathway Tp3. The position d4includes the start point of the pathway Tp4, and the position d5includes the end point of the pathway Tp4. The position d5 includes thestart point of the pathway Tp5, and the position d6 includes the endpoint of the pathway Tp5. The pathway Tp1 is a pathway on which thesubstrate P moves in the +Y direction. The pathway Tp3 is a pathway onwhich the substrate P moves in the −Y direction. The pathway Tp5 is apathway on which the substrate P moves in the +Y direction. The pathwayTp2 and the pathway Tp4 are pathways on which the substrate P moves inthe direction which has the +X direction as the main component.

When the substrate P moves on the pathway Tp1 in the state where theliquid immersion space LS is formed, the exposure light EL is radiatedto the shot region Sa via the liquid LQ. When the substrate P moves onthe pathway Tp3 in the state where the liquid immersion space LS isformed, the exposure light EL is radiated to the shot region Sb via theliquid LQ. When the substrate P moves on the pathway Tp5 in the statewhere the liquid immersion space LS is formed, the exposure light EL isradiated to the shot region Sc via the liquid LQ. When the substrate Pmoves on the pathway Tp2 and the pathway Tp4, the exposure light EL isnot radiated.

Each of the operations in which the substrate P moves the pathway Tp1,the operation in which the substrate P moves the pathway Tp3, and theoperation in which the substrate P moves the pathway Tp5 includes thescan movement operation. Moreover, each of the operations in which thesubstrate P moves the pathway Tp2 and the operation in which thesubstrate P moves the pathway Tp4 includes the step movement operation.

That is, each of the periods in which the substrate P moves the pathwayTp1, the period in which the substrate P moves the pathway Tp3, and theperiod in which the substrate P moves the pathway Tp5 includes the scanmovement period (exposure period). Each of the periods in which thesubstrate P moves the pathway Tp2 and the period in which the substrateP moves the pathway Tp4 includes the step movement period.

FIG. 18 is a schematic view showing an example of the operation of thesecond member 22. FIG. 18 is a view when the second member 22 is viewedfrom the upper surface 25 side. When the substrate P is positioned atthe position d1, the second member 22 is disposed at the position shownin FIG. 18(A) with respect to the projection region PR (the optical pathK of the exposure light EL). When the substrate P is positioned at theposition d2, the second member 22 is disposed at the position shown inFIG. 18(B) with respect to the projection region PR (the optical path Kof the exposure light EL). That is, during the scan movement operationof the substrate P from the position d1 to the position d2, the secondmember 22 moves in the −X direction, which is opposite to the direction(+X direction) of the step movement of the substrate P. When thesubstrate P is positioned at the position d2.5, the second member 22 isdisposed at the position shown in FIG. 18(C) with respect to theprojection region PR (the optical path K of the exposure light EL). Whenthe substrate P is positioned at the position d3, the second member 22is disposed at the position shown in FIG. 18(D) with respect to theprojection region PR (the optical path K of the exposure light EL). Thatis, during the step movement operation of the substrate P from theposition d2 to the position d3, the second member 22 moves in the +Xdirection, which is the same as the direction (+X direction) of the stepmovement of the substrate P. When the substrate P is positioned at theposition d4, the second member 22 is disposed at the position shown inFIG. 18(E) with respect to the projection region PR (the optical path Kof the exposure light EL). That is, during the scan movement operationof the substrate P from the position d3 to the position d4, the secondmember 22 moves in the −X direction, which is opposite to the direction(+X direction) of the step movement of the substrate P. When thesubstrate P is positioned at the position d4.5, the second member 22 isdisposed at the position shown in FIG. 18(F) with respect to theprojection region PR (the optical path K of the exposure light EL). Whenthe substrate P is positioned at the position d5, the second member 22is disposed at the position shown in FIG. 18(G) with respect to theprojection region PR (the optical path K of the exposure light EL). Thatis, during the step movement operation of the substrate P from theposition d4 to the position d5, the second member 22 moves in the +Xdirection, which is the same as the direction (+X direction) of the stepmovement of the substrate P. When the substrate P is positioned at theposition d6, the second member 22 is disposed at the position shown inFIG. 18(H) with respect to the projection region PR (the optical path Kof the exposure light EL). That is, during the scan movement operationof the substrate P from the position d5 to the position d6, the secondmember 22 moves in the −X direction, which is opposite to the direction(+X direction) of the step movement of the substrate P.

In the present embodiment, the positions of the second member 22 shownin FIGS. 18(A), 18(D), and 18(G) include the second end part position.The positions of the second member 22 shown in FIGS. 18(B), 18(E), and18(H) include the first end part position. The positions of the secondmember 22 shown in FIGS. 12(C) and 12(F) include the center position.

In the descriptions below, the positions of the second member 22 shownin FIGS. 18(A), 18(D), and 18(G) are set to the second end partposition, the positions of the second member 22 shown in FIGS. 18(B),18(E), and 18(H) are set to the first end part position, and thepositions of the second member 22 shown in FIGS. 18(C) and 18(F) are setto the center position.

When the substrate P moves on the pathway Tp1, the second member 22moves in the −X direction so as to be changed from the state shown inFIG. 18(A) to the state shown in FIG. 18(B). That is, the second member22 moves from the second end part position to the first end partposition via the center position. When the substrate P moves on thepathway Tp2, the second member 22 moves in the +X direction so as to bechanged from the state shown in FIG. 18(B) to the state shown in FIG.18(D) via the state shown in FIG. 18(C). That is, the second member 22moves from the first end part position to the second end part positionvia the center position. When the substrate P moves on the pathway Tp3,the second member 22 moves in the −X direction so as to be changed fromthe state shown in FIG. 18(D) to the state shown in FIG. 18(E). That is,the second member 22 moves from the second end part position to thefirst end part position via the center position. When the substrate Pmoves on the pathway Tp4, the second member 22 moves in the +X directionso as to be changed from the state shown in FIG. 18(E) to the stateshown in FIG. 18(G) via the state shown in FIG. 18(F). That is, thesecond member 22 moves from the first end part position to the secondend part position via the center position. When the substrate P moves onthe pathway Tp5, the second member 22 moves in the −X direction so as tobe changed from the state shown in FIG. 18(G) to the state shown in FIG.18(H). That is, the second member 22 moves from the second end partposition to the first end part position via the center position.

That is, in the present embodiment, the second member 22 moves in the +Xdirection so that the relative movement between the second member andthe substrate P is decreased in at least a part of a period in which thesubstrate P moves along the pathway Tp2. In other words, the secondmember 22 moves in the +X direction so that the relative speed betweenthe second member and the substrate P with respect to the X axisdirection is decreased in at least a part of a period in which thesubstrate P performs the step movement operation which includes thecomponent in the +X direction. Similarly, the second member 22 moves inthe +X axis direction so that the relative speed between the secondmember and the substrate P with respect to the X direction is decreasedin at least a part of a period in which the substrate P moves along thepathway Tp4.

Moreover, in the present embodiment, the second member 22 moves in the−X direction in at least a part of a period in which the substrate Pmoves along the pathway Tp3. Accordingly, after the movement of thesubstrate P on the pathway Tp3, during in the movement of the pathwayTp4, even when the second member 22 moves in the +X direction, theexposure light EL is able to pass through the opening 35. Also in thecase where the substrate P moves on the pathways Tp1 and Tp5, theexposure light is able to pass through the opening

That is, when the substrate P repeats the scan movement operation andthe step movement operation including the component in the +X direction,during the step movement operation, the second member 22 moves in the +Xdirection from the first end part position to the second end partposition so that the relative speed between the second member and thesubstrate P is decreased, and during the scan movement operation, thesecond member 22 returns from the second end part position to the firstend part position so that the second member 22 moves in the +X directionagain in the next step movement operation. That is, since the secondmember 22 moves in −X direction in at least a part of a period in whichthe substrate P performs the vertical scan movement operation, the sizeof the opening 35 can be suppressed to the required minimum.

Moreover, in the embodiment, even when the second member 22 is disposedat the first end part position (second end part position), at least aportion of the fluid recovery part 27 is continuously opposite to thesubstrate P (object). Accordingly, for example, in the step movementoperation, the fluid recovery part 27 is able to recover the liquid LQon the substrate P (object).

Moreover, in the example described using FIGS. 17 and 18, when thesubstrate P is positioned at the positions d1, d3, and d5, the secondmember 22 is disposed at the second end part position. When thesubstrate P is positioned at the positions d1, d3, and d5, the secondmember 22 may be disposed at the center position and may be disposedbetween the center position and the second end part position.

In addition, in the example described using FIGS. 17 and 18, when thesubstrate P is positioned at the positions d2, d4, and d6, the secondmember 22 is disposed at the first end part position. When the substrateP is positioned at the positions d2, d4, and d6, the second member 22may be disposed at the center position and may be disposed between thecenter position and the first end part position.

Moreover, when the substrate P is positioned at the positions d2.5 andd4.5, the second member 22 may be disposed at positions different fromthe center position. That is, when the substrate P is positioned at thepositions d2.5 and d4.5, for example, the second member 22 may bedisposed between the center position and the second end part positionand may be disposed between the center position and the first end partposition.

Due to the movement of the second member 22, vibration may occur.Moreover, due to the operation of the driving apparatus 56, vibrationmay occur. In the present embodiment, the second member 22 is supportedby the apparatus frame 8B via the second supporting member 52, themoving frame 54, or the like. In addition, the driving apparatus 56 isalso supported by the apparatus frame 8B. In the present embodiment, thevibration isolator 10 is disposed between the apparatus frame 8B and thereference frame 8A. Accordingly, even when vibration occurs due to themovement of the second member 22, the operation of the driving apparatus56, or the like, by the vibration isolator 10, the vibration issuppressed from being transmitted to the reference frame 8A. Therefore,the vibration of the terminal optical element 13 (projection opticalsystem PL) and the change in the position of the terminal opticalelement 13 (projection optical system PL) are suppressed.

Moreover, in the present embodiment, the vibration isolator 55 isprovided to suppress the vibration of the first member 21. In thepresent embodiment, the vibration isolator 55 is disposed between theapparatus frame 8B and the support frame 53. Accordingly, even whenvibration occurs due to the movement of the second member 22, theoperation of the driving apparatus 56, or the like, by the vibrationisolator 55, the vibration is suppressed from being transmitted to thesupport frame 53. Therefore, the vibration of the first member 21 andthe change in the position of the first member 21 are suppressed.

In the present embodiment, the second member 22 moves in the plane whichis substantially perpendicular to the optical axis of the terminaloptical element 13. In this case, the first member 21 may vibrate notonly in the X axis direction and the Y axis direction but also in the Zaxis direction which is substantially parallel to the optical axis ofthe terminal optical element 13. Moreover, the position of the firstmember 21 with respect to the Z axis direction may be changed. In thiscase, for example, the size (the size of the third space SP3) of the gapbetween the first member 21 and the terminal optical element 13 may bechanged, the pressure of the third space SP3 may be changed, theterminal optical element 13 may be displaced (or deformed) due to thechange of the pressure of the third space SP3, or the liquid LQ may flowout from the third space SP3. In addition, if the first member 21vibrates in the Z axis direction or the position of the first member 21with respect to the Z axis direction is changed, there is a possibilitythat the size of the gap (the size of the second space SP2) between thefirst member 21 and the object (at least one of the substrate P, thesubstrate stage 2, and the measurement stage 3) is changed, the pressureof the second space SP2 is changed, the object is displaced (ordeformed) due to the change in the pressure of the second space SP2, andthe liquid LQ flows out from the second space SP2. As a result, there isa possibility that an exposure failure occurs or a defective device isobtained.

In the present embodiment, the vibration isolator 55 is able to suppressthe vibration of the first member 21 with respect to at least the Z axisdirection. Moreover, in the present embodiment, the vibration isolator55 is able to move the first member 21 so that the displacement of thefirst member 21 with respect to at least the Z axis direction issuppressed. Accordingly, occurrence of the exposure failure andoccurrence of the defective device are suppressed.

Moreover, in the present embodiment, the vibration isolator 55 is ableto suppress the vibration of the first member 21 with respect to notonly the Z axis direction but also to six directions of the X axis, theY axis, the Z axis, the θX, the θY, and the θZ, and is able to move thefirst member 21 so that the displacement of the first member 21 withrespect to six directions is suppressed. When the first member 21 mayvibrate or may be displaced in at least one direction of six directions,the vibration and the displacement are favorably suppressed due to themovement of the second member 22. Accordingly, occurrence of theexposure failure and occurrence of the defective device are effectivelysuppressed.

In addition, in the present embodiment, the vibration isolator 55 maysuppress the vibration of the first member 21 only with respect to the Zaxis direction. Moreover, the vibration isolator 55 may move the firstmember 21 so that the displacement of the first member 21 is suppressedonly with respect to the Z axis direction.

Moreover, in the present embodiment, the vibration isolator 55 maysuppress the vibration of the first member 21 with respect to any of twoto five optional directions of six directions of the X axis, the Y axis,the Z axis, the θX, the θY, and the θZ. Moreover, the vibration isolator55 may move the first member 21 in order to suppress the displacement ofthe first member 21 with respect to any of two to five optionaldirections of six directions of the X axis, the Y axis, the Z axis, theθX, the θY, and the θZ. For example, the vibration isolator 55 may beoperated based on a direction (or a direction with a high vibrationlevel) with a high possibility of an occurrence of the vibration of thefirst member 21 or a direction (or a direction with a high displacementlevel) with a high possibility of an occurrence of the displacement ofthe first member 21.

In the present embodiment, the first member 21 is moved by the vibrationisolator 55 based on the detection result of the detection apparatus 62.Accordingly, the displacement of the first member 21 with respect to theterminal optical element 13 (reference member) is favorably suppressed.

Moreover, in the present embodiment, the vibration isolator 55 isoperated so that the vibration of the first member 21 is suppressedbased on the detection result of the detection apparatus 63.Accordingly, the vibration of the first member 21 is favorablysuppressed.

In addition, the vibration isolator 55 may be controlled so that thedisplacement of the first member 21 is suppressed based on the detectionresult of the detection apparatus 63. Moreover, the vibration isolator55 may be controlled so that the vibration of the first member 21 issuppressed based on the detection result of the detection apparatus 62.

In addition, in the present embodiment, the controller 6 may control thevibration isolator 55 without using the detection results from thedetection apparatuses 62 and 63.

For example, when vibration conditions (at least one of frequency,amplitude, a vibration direction, and a vibration mode) of the firstmember 21 are changed based on the movement conditions of the secondmember 22, the vibration isolator 55 may be controlled so that thevibration of the first member 21 is suppressed based on the movementconditions of the second member 22.

For example, when a relationship between the movement conditions of thesecond member 22 and the vibration conditions of the first member 21 arestored in the storage apparatus 7, the controller 6 may control thevibration isolator 55 so that the vibration of the first member 21 issuppressed based on the information from the storage apparatus 7.

For example, as described referring to FIGS. 16 to 18, when the movementconditions of the object (substrate P or the like) based on the exposurerecipe (exposure control information) are determined and the movementconditions of the second member 22 based on the movement conditions ofthe objet are determined, it is possible to obtain information withrespect to the vibration conditions of the first member 21 based on themovement conditions of the second member 22 before the liquid immersionspace LS is formed on the object (or before the substrate P is exposed).In addition, for example, the information with respect to the vibrationconditions of the first member 21 is able to be obtained by apreliminary experiment (an identification experiment with respect to thefirst member 21, or the like), simulation, or the like, in advance.

Accordingly, by storing in the storage apparatus 7 the relationshipsbetween the movement conditions of the second member 22 and thevibration conditions of the first member 21, which are acquired inadvance by the identification experiment, simulation, or the like,before the liquid immersion space LS is formed on the object or thesubstrate P is exposed, it is possible for the controller 6 to controlthe vibration isolator 5 so that the vibration of the first member 21based on the information of the storage apparatus 7 is suppressed.

Moreover, when the displacement conditions (at least one of adisplacement amount and a displacement direction) of the first member 21are changed based on the movement conditions of the second member 22,the vibration isolator 55 may be controlled so that the displacement ofthe first member 21 is suppressed based on the movement conditions ofthe second member 22.

For example, when relationships between the movement conditions of thesecond member 22 and the positions of the first member 21 with respectto the reference member (terminal optical element 13 or the like) arestored in the storage apparatus 7, the controller 6 may control thevibration isolator 55 so that the displacement of the first member 21 issuppressed based on the information of the storage apparatus 7.

For example, as described referring to FIGS. 16 to 18, when the movementconditions of the object (substrate P or the like) based on the exposurerecipe (exposure control information) are determined and the movementconditions of the second member 22 based on the movement conditions ofthe object are determined, the information related to the position ofthe first member 21 with respect to the reference member is able to beobtained based on the movement conditions of the second member 22 beforethe liquid immersion space LS is formed on the object (or before thesubstrate P is exposed). Moreover, for example, the information withrespect to the position of the first member 21 is able to be obtained bya preliminary experiment, simulation, or the like, in advance.

Accordingly, by storing in the storage apparatus 7 the relationshipsbetween the movement conditions of the second member 22 and thepositions of the first member 21 with respect to the reference member,which are acquired in advance by the preliminary experiment, simulation,or the like, before the liquid immersion space LS is formed on theobject or the substrate P is exposed, it is possible for the controller6 to control the vibration isolator 5 so that the displacement of thefirst member 21 based on the information of the storage apparatus 7 issuppressed.

That is, in the present embodiment, the controller 6 is able to performa feedback control, which controls the vibration isolator 55, based onthe detection results of the detection apparatuses 62 and 63. Moreover,the controller 6 is able to perform a feed-forward control, whichcontrols the vibration isolator 55, based on the information of thestorage apparatus 7.

As described above, according to the present embodiment, since thevibration isolator 55 is provided, occurrence of exposure failure andoccurrence of a defective device can be suppressed.

Moreover, in the present embodiment, the first member 21 may vibrateregardless of the movement of the second member 22. The vibrationisolator 55 may suppress the vibration of the first member 21 regardlessof the movement of the second member 22.

In addition, in the present embodiment, the first member 21 may bedisplaced regardless of the movement of the second member 22. Thevibration isolator 55 may suppress the displacement of the first member21 regardless of the movement of the second member 22.

Moreover, in the present embodiment, the vibration isolator 55 may be aso-called passive type vibration isolator which does not include anactuator and includes a damping apparatus (damper).

In addition, in the present embodiment, the first member 21 may besupported by the reference frame 8A.

Moreover, in the present embodiment, at least a portion of the referenceframe 8A and the support frame 53 may be the same member.

In addition, as shown in FIG. 19, the vibration isolator 55 may bedisposed to be opposite to the upper surface 53A of the support frame 53facing the +Z direction. For example, at least a portion of theapparatus frame 8B is disposed above the support frame 53, and thevibration isolator 55 may be disposed to be suspended from the apparatusframe 8B. The vibration isolator 55, which is suspended from theapparatus frame 8B, may hold the support frame 53 in a suspendingmanner. That is, the support frame 53 may be disposed to be suspendedfrom the vibration isolator 55.

Moreover, as shown in FIG. 19, the driving apparatus 56 may be disposedbelow the apparatus frame 8B. That is, the driving apparatus 56 may bedisposed to be suspended from the apparatus frame 8B.

Moreover, in the present embodiment, the liquid immersion member 5 doesnot include a channel which fluidly connects the first space SP1 and thesecond space SP2 except for the opening 35. For example, an opening(hole) which fluidly connects the first space SP1 and the second spaceSP2 may be formed outside the opening 35 with respect to the opticalpath K.

Moreover, in the present embodiment, the supply port, which supplies theliquid LQ to the first space SP1, may be provided on at least one of thefirst member 21 and the second member 22. For example, a supply portsupplying the liquid LQ may be provided at the lower surface 23 of thefirst member 21 between the opening 34 and the liquid recovery part 24.

Second Embodiment

A second embodiment will be described. In the descriptions below, thesame reference numerals are attached to the same or similar componentsas those of the above-described embodiment, and the descriptions thereofare simplified or omitted.

FIG. 20 is a cross-sectional view parallel to the YZ plane of a liquidimmersion member 500 according to the present embodiment. FIG. 21 is across-sectional view parallel to the XZ plane of the liquid immersionmember 500. FIG. 22 is a view in which a portion of FIG. 20 is enlarged.FIG. 23 is a view when the liquid immersion member 500 is viewed fromthe lower side (−Z side). FIG. 24 is a perspective view of the liquidimmersion member 500. FIG. 25 is a perspective view showing an exampleof a supporting apparatus 5000 which supports the liquid immersionmember 500.

The liquid immersion member 500 includes a first member 210 which isdisposed at at least a portion of the surrounding of the terminaloptical element 13, a second member 220 which is disposed at at least aportion of the surrounding of the optical path K below the first member210 and which is able to move with respect to the first member 210, asupply part 330 which is able to supply the liquid LQ to form the liquidimmersion space LS, and a recovery part 230 which is able to recover theliquid LQ. The first member 210 is an annular member which is disposedat the surrounding of the terminal optical element 13. The second member220 is an annular member which is disposed at the surrounding of theoptical path K. The first member 210 includes an opening 340 throughwhich the exposure light EL from the emitting surface 12 is able topass. The second member 220 includes an opening 350 through which theexposure light EL from the emitting surface 12 is able to pass.

The first member 210 includes a lower surface 240 facing the −Z axisdirection. The second member 220 includes an upper surface 250 facingthe +Z axis direction and a lower surface 260 facing the −Z axisdirection. The substrate P (object) is able to be opposite to the lowersurface 260. The upper surface 250 is opposite to the lower surface 240via a gap. Moreover, in the present embodiment, at least a portion ofthe upper surface 250 is opposite to the emitting surface 12 via a gap.In addition, the upper surface 250 may not be opposite to the emittingsurface 12.

A supply port 330 is disposed inside the recovery part 230 with respectto a radial direction to the optical axis (optical path K) of theterminal optical element 13. The supply part 330 is disposed at thefirst member 210. In the present embodiment, the supply port 330 isdisposed to be opposite to the side surface 13F. The supply port 330supplies the liquid LQ to the third space SP3. Moreover, the supply port330 may be disposed at the second member 220, and may be disposed atboth of the first member 210 and the second member 220.

The recovery part 230 is disposed outside the lower surface 240 of thefirst member 210 with respect to the optical path K (the optical axis ofthe terminal optical element 13). The lower surface 240 does not recoverthe liquid LQ. The substrate P (object) is able to be opposite to atleast a portion of the recovery part 230. The recovery part 230 is ableto recover at least a portion of the liquid LQ from the first space SP1which the upper surface 250 faces and the second space SP2 which thelower surface 260 faces. The first space SP1 includes a space betweenthe lower surface 240 and the upper surface 250. The second space SP2includes a space between the lower surface 260 and the upper surface ofthe substrate P (object). In the present embodiment, the recovery part230 is disposed at the first member 210. At least a portion of thesecond member 220 is opposite to the recovery part 230. The secondmember 220 may not be opposite to the recovery part 230. In addition,the recovery part 230 may be disposed at a member different from thefirst member 210 and the second member 220.

In the present embodiment, the recovery part 230 includes a porousmember 380. The liquid LQ above the substrate P (object) is recoveredvia holes of the porous member 380. The holes (openings) of the porousmember 380 function as recovery ports which recover the liquid LQ. Inthe present embodiment, the porous member 380 includes a mesh plate.

Since the recovery operation of the liquid LQ from the recovery part 230(recovery ports) is performed in parallel with the supply operation ofthe liquid LQ from the supply port 330, the liquid immersion space LS isformed between the terminal optical element 13 and the liquid immersionmember 500 of one side and the substrate P (object) of the other side,by the liquid LQ.

The supporting apparatus 5000 includes a first supporting member 400which supports the first member 210, a second supporting member 280which supports the second member 200, and a driving apparatus 270 whichis able to move the second member 220. The first supporting member 400is supported by the support frame 53. The driving apparatus 270 issupported by the support frame 53. The second supporting member 280 isconnected to the driving apparatus 270. The second supporting member 280is supported by the support frame 53 via the driving apparatus 270.

The support frame 53 supports first member 210 via the first supportingmember 400. The support frame 53 supports the second member 220 via thedriving apparatus 270 and the second supporting member 280.

Similar to the above-described embodiment, the support frame 53 may notbe supported by the apparatus frame 8B via the vibration isolator 55.The apparatus frame 8B may support the first member 210 and the secondmember 220 via the vibration isolator 55 and the support frame 53.

The second member 220 is driven by the driving apparatus 270. Forexample, the driving apparatus 270 includes a motor, and is able to movethe second member 220 using Lorentz force. The driving apparatus 270moves the second member 220 in at least the X axis direction. Moreover,the driving apparatus 270 may move the second member 220 in sixdirections of the X axis, the Y axis, the Z axis, the θX, the θY, andthe θZ.

The supporting member 280 is connected to at least a portion of thesecond member 220. The supporting member 280 is moved by the drivingapparatus 270, and thus, the second member 220 is moved. In the presentembodiment, the supporting member 280 includes a first portion 2801which includes an upper end part and a lower end part, a second portion2802 which is connected to the upper end part of the first portion 2801,and a third portion 2803 which is connected to the second portion 2802.The lower end part of the first portion 2801 is connected to at least aportion of the upper surface 250 of the second member 220.

In the present embodiment, the first portions 2801 of the supportingmember 280 are each disposed at the +Y side and the −Y side with respectto the optical path K (the optical axis of the terminal optical element13).

Moreover, the disposition of the plurality of first portions 2801 is notlimited to the +Y side and the −Y side. For example, the first portionsmay be disposed at each of the +X side and the −X side, and may bedisposed at each of the +Y side, the −Y side, the +X side, and the −Xside.

In the present embodiment, the second portion 2802 is connected to theplurality of first portions 2801. The third portion 2803 is disposedbetween the second portion 2802 and the driving apparatus 270. Thedriving apparatus 270 is connected to the third portion 2803. Moreover,the second portion 2802 and the third portion 2803 may be considered asan integral component. In the present embodiment, the driving apparatus270 is disposed at the −Y side with respect to the optical axis of theterminal optical element 13.

In the present embodiment, the first member 210 includes an innersurface 300 opposite to the side surface 13F of the terminal opticalelement 13, and an upper surface 310 which is disposed at thesurrounding of the upper end of the inner surface 300. The side surface13F of the terminal optical element 13 is a non-emitting surface inwhich the exposure light EL is not emitted. The exposure light EL passesthrough the emitting surface 12 without passing through the side surface13F.

In the present embodiment, the plurality of first portions 2801 aredisposed so as to move in each of a plurality of holes 320 which areprovided at the first member 210. In the present embodiment, the holes320 are provided at each of the +Y side and the −Y side with respect tothe optical path K. Each of the holes 320 penetrates the first member210 so as to connect the upper side space and the lower side space ofthe first member 210 with respect to the Z axis direction. The upperside space of the first member 210 includes the third space SP3 betweenthe terminal optical element 13 and the first member 210. The lower sidespace of the first member 210 includes the first space SP1 between thefirst member 210 and the second member 220. Moreover, the lower sidespace of the first member 210 may include the second space SP2 betweenthe second member 220 and the object (substrate P or the like).

In the present embodiment, each of the holes 320 is formed so as toconnect the inner surface 300 and the lower surface 240 of the firstmember 210. Moreover, as shown in FIG. 24, each of the holes 320 extendsin the X axis direction, and the first portion 2801 which is disposed atthe hole 320 is able to move in the X axis direction. The supportingmember 280 is moved in the X axis direction by the driving apparatus270, and thus, the second member 220 is moved in the X axis direction.

In addition, at least one of the holes 320 in which the first portions2801 are disposed may be formed so as to connect the upper surface 310and the lower surface 240 of the first member 210.

A vibration isolator 450, which suppresses the vibration of the firstmember 210, is provided. In the present embodiment, at least a portionof the vibration isolator 450 is connected to the first supportingmember 400. At least a portion of the vibration isolator 450 may beconnected to the first member 210. The vibration isolator 450 may beconnected to both of the first member 210 and the first supportingmember 400. The vibration isolator 450 includes a so-called mass damper.The vibration isolator 450 suppresses the vibration of the first member210 caused by the movement of the second member 220. The vibrationisolator 450 can suppress the vibration of the first member 210generated regardless of the movement of the second member 22. Forexample, the vibration isolator 450 suppresses the vibration of thefirst member 210 with respect to the Z axis direction. In addition, thevibration isolator 450 may suppress the vibration of the first member210 with respect to six directions of the X axis, the Y axis, the Zaxis, the θX, the θY, and the θZ.

The vibration isolator 450 may be disposed at one location in the firstmember 210 (first supporting member 400), and may be disposed atplurality of locations.

In the present embodiment, a temperature adjustment apparatus 410, whichadjusts the temperature of the driving apparatus 270, is provided. Forexample, the temperature adjustment apparatus 410 may include a tubemember which is disposed so as to contact at least a portion of thedriving apparatus 270, and a fluid supply apparatus which supplies afluid (one or both of liquid and gas), in which temperature is adjusted,to a channel included in the tube member. In addition, the temperatureadjustment apparatus 410 may include a fluid supply apparatus whichsupplies the fluid, in which the temperature is adjusted, to an innerchannel which is formed in at least a portion of the driving apparatus270. According to the supplied fluid, the temperature of the drivingapparatus 270 may be adjusted. Moreover, the temperature adjustmentapparatus 410 may include a peltier element which is disposed at thedriving apparatus 270.

In addition, a temperature adjustment apparatus which adjusts thetemperature of the driving apparatus 56 may be provided in theabove-described first embodiment. Moreover, a temperature adjustmentapparatus which adjust the temperature of the vibration isolator 55 maybe provided.

In the present embodiment, the second member 220 and the supportingmember 280 do not contact the first member 210. A gap is formed betweenthe first member 210 and the second member 220, and a gap is formedbetween the first member 210 and the supporting member 280. The drivingapparatus 270 is able to move the second member 220 and the supportingmember 280 so that the second member 220, the supporting member 280, andthe first member 210 do not contact one another.

In the present embodiment, the supporting apparatus 5000 includes asupporting part 420 which supports at least a portion of the secondmember 220 in a non-contact manner. In the present embodiment, thesupporting part 420 supports the third portion 2803 in a non-contactmanner. Moreover, the second portion 2802 and the third portion 2803 maybe considered as an integral component. In this case, the supportingpart 420 supports the second portion in a non-contact manner.

FIG. 26 is a view showing an example of the supporting part 420. In thepresent embodiment, at least a portion of the supporting part 420 isdisposed at the first member 210. In the present embodiment, at least aportion of the supporting part 420 is disposed at the upper surface 310of the first member 210.

The supporting apparatus 5000 includes a gas bearing 420G between thelower surface of the third portion 2803 and the upper surface 310(supporting part 420) of the first member 210. The supporting part 420includes the gas bearing 420G. The gas bearing 420G includes a gassupply port 420S which supplies gas between the third portion 2803 andthe first member 210, and a gas discharge port 420C which discharges thegas between the third portion 2803 and the first member 210. Accordingto the gas bearing 420G the third portion 2803 (second supporting member280) is supported (first member 210) in a non-contact manner withrespect to the supporting part 420. Moreover, the supporting part 420Gguides the second supporting member 280 (third portion 2803) in the Xaxis direction.

In addition, at least one of the second member 220 and the supportingmember 280, and the first member 210 may contact each other.

As described above, according to the present embodiment, the supportframe 53 which supports the first member 210 and the second member 220is supported by the vibration isolator 55, for example, even whenvibration occurs due to the movement of the second member 220,transmission of the vibration to the apparatus frame 8B or transmissionof the vibration to the reference frame 8A is suppressed. Accordingly,for example, vibration of the terminal optical element 13 (projectionoptical system PL) can be suppressed. Therefore, occurrence of exposurefailure and occurrence of a defective device are suppressed.

Moreover, in the present embodiment, the vibration isolator 450 isconnected to the first member 210 to suppress the vibration of the firstmember 210. Accordingly, for example, even when vibration occurs due tothe movement of the second member 220, the vibration of the first member210 is suppressed. Moreover, by suppressing the vibration of the firstmember 210, the change in the size of the third space SP3 or the changein the pressure of the third space SP3 is suppressed. Therefore, thedisplacement (or deformation) of the terminal optical element 13 or theflowing-out of the liquid LQ from the third space SP3 is suppressed. Inaddition, by suppressing the vibration of the first member 210, thechange in the size of the second space SP2 or the change in the pressureof the second space SP2 is suppressed. Accordingly, the displacement (ordeformation) of the object (substrate P or the like) or the flowing-outof the liquid LQ from the second space SP2 is suppressed.

As shown in FIG. 27, a detection apparatus 620, which detects theposition of the first member 210 with respect to the reference member6200, may be provided. The position of the reference member 6200 issubstantially fixed. For example, the reference member 6200 may be atleast a portion of the projection optical system PL. For example, thereference member 6200 may be a holding member (barrel or the like) whichholds the optical elements of the projection optical system PL. Thereference member 6200 may be the reference frame 8A which supports theprojection optical system PL. The reference member 6200 may be a memberwhich is fixed to the projection optical system PL, and may be a memberwhich is fixed to the reference frame 8A.

The detection apparatus 620 includes a position sensor (displacementsensor) which is able to detect the position of the first member 210with respect to the reference member 6200. The detection apparatus 620is able to detect the position of the first member 210 at least withrespect to the Z axis direction. In the present embodiment, at least aportion of the detection apparatus 620 is opposite to the referencemember 6200 via a gap. Moreover, the detection apparatus 620 may detectthe positions of the first member 210 with respect to six directions ofthe X axis, the Y axis, the Z axis, the θX, the θY, and the θZ.

The detection result of the detection apparatus 620 is output to thecontroller 6. The controller 6 may move the first member 210 based onthe detection result of the detection apparatus 620 so that thedisplacement of the first member 210 with respect to the referencemember 6200 is suppressed. The controller 6 may move the support frame53 by using the vibration isolator 55 based on the detection result ofthe detection apparatus 620 so that the displacement of the first member210 with respect to the reference member 6200 is suppressed.

Moreover, the controller 6 may detect the vibration of the first member210 by using the detection apparatus 620. The controller 6 may detectthe vibration (acceleration) of the first member 210 by performingcalculation processing with respect to the detection value of thedetection apparatus 620. The controller 6 may control the vibrationisolator 450 based on the detection result of the detection apparatus620 so that the vibration of the first member 210 is suppressed. Whenthe vibration isolator 450 includes an actuator, the controller 6 isable to perform active vibration-isolation (vibration-proof) by usingthe vibration isolator 450 based on the detection result of thedetection apparatus 620 so that the vibration of the first member 210 issuppressed. Moreover, when a vibration sensor, (an acceleration sensoror the like), which is able to detect the vibration of the first member210, is disposed at the first member 210, the controller 6 may controlthe vibration isolator 450 based on the detection result of thevibration sensor so that the vibration of the first member 210 issuppressed.

Furthermore, in the above-described first, second, and thirdembodiments, as shown in FIG. 28, at least a portion of the first member21 (210) may be opposite to the emitting surface 12 of the terminaloptical element 13. In the example shown in FIG. 28, the first member 21(210) includes an upper surface 44 which is disposed at the surroundingof the opening 34 (340). The upper surface 44 is disposed at thesurrounding of the upper end of the opening 34 (340). Moreover, in theexample shown in FIG. 28, a portion of the upper surface of the secondmember 22 (220) is also opposite to the emitting surface 12.

In addition, in the above-described first and second embodiments, asshown in FIG. 29, the lower surface of the first member 21 (210) may bedisposed at more +Z side than the emitting surface 12. Moreover, theposition (height) of the lower surface of the first member 21 (210) andthe position (height) of the emitting surface 12 with respect to the Zaxis direction may be substantially the same as each other. The lowersurface of the first member 21 (210) may be disposed at more −Z sidethan the emitting surface 12.

In addition, in each of the above-described embodiments, a suction port,which sucks at least one of the liquid LQ and the gas from the spacebetween the first member 21 (210) and the terminal optical element 13,may be provided at the first member 21.

Moreover, in the above-described embodiment, the controller 6 includes acomputer system which includes a CPU or the like. In addition, thecontroller 6 includes an interface which is able to performcommunication with a computer system and an external apparatus. Forexample, the storage apparatus 7 includes a memory such as a RAM, a harddisk, and a recording medium such as a CD-ROM. In the storage apparatus7, an operating system (OS) which controls the computer system isinstalled and a program used to control the exposure apparatus EX isstored.

Moreover, an input apparatus which is able to input signals may beconnected to the controller 6. The input apparatus includes inputequipment such as a keyboard or a mouse, a communication apparatus orthe like which is able to input data from the external apparatus, andthe like. Moreover, a display apparatus such as a liquid crystal displaymay be also provided.

The controller (computer system) 6 is able to read various informationwhich includes the programs which are recorded in the storage apparatus7. Programs are recorded in the storage apparatus 7, and the programsmake the controller 6 perform the control of the liquid immersionexposure apparatus which exposes the substrate by the exposure light viathe liquid filled in the optical path of the exposure light between theemitting surface of the optical member from which the exposure light isemitted and the substrate.

According to the above-described embodiments, the programs which arerecorded in the storage apparatus 7 may make the controller 6 perform:forming the liquid immersion space of the liquid on the substrate, usingthe liquid immersion member that includes the first member disposed atat least a portion of the surrounding of the optical member, and thesecond member that is disposed at at least a portion of the surroundingof the optical path of the exposure light below the first member andthat includes the second upper surface opposite to a first lower surfaceof the first member via a gap, and the second lower surface that is ableto be opposite to the substrate capable of moving below the opticalmember; exposing the substrate by the exposure light emitted from theemitting surface via the liquid in the liquid immersion space; movingthe second member with respect to the first member in at least a portionof the exposure of the substrate; and suppressing the vibration of thefirst member by the vibration isolator.

In addition, according to the above-described embodiments, the programswhich are recorded in the storage apparatus 7 may make the controller 6perform: forming the liquid immersion space of the liquid on thesubstrate, using the liquid immersion member that includes the firstmember disposed at at least a portion of the surrounding of the opticalmember, and the second member that is disposed at at least a portion ofthe surrounding of the optical path of the exposure light below thefirst member and that includes the second upper surface opposite to afirst lower surface of the first member via a gap, and the second lowersurface that is able to be opposite to the substrate capable of movingbelow the optical member; exposing the substrate by the exposure lightemitted from the emitting surface via the liquid in the liquid immersionspace; moving the second member with respect to the first member in atleast a portion of the exposure of the substrate; and moving the firstmember by the first driving apparatus to suppress the displacement ofthe first member with respect to the reference member.

The programs which are stored in the storage apparatus 7 are read by thecontroller 6, and thus, various apparatuses of the exposure apparatus EXsuch as the substrate stage 2, the measurement stage 3, and the liquidimmersion member 5 cooperate with one another and perform variousprocessing such as the liquid immersion exposure of the substrate P inthe state where the liquid immersion space LS is formed.

Moreover, in each of the above-described embodiments, the optical path Kat the emitting surface 12 side (image surface side) of the terminaloptical element 13 of the projection optical system PL is filled withthe liquid LQ. However, for example, the projection optical system PLmay be the projection optical system in which the optical path of theincident side (object surface side) at the terminal optical element 13is also filled with the liquid LQ as disclosed in PCT InternationalPublication No. WO 2004/019128.

In addition, in each of the above-described embodiments, the liquid LQis water. However, the liquid may be liquid other than the water. It ispreferable that the liquid LQ be transparent with respect to theexposure light EL, have a high refractive index with respect to theexposure light EL, and be stable with respect to the projection opticalsystem PL or the film of a photosensitive material (photoresist) whichforms the surface of the substrate P or the like. For example, theliquid LQ may be fluorinated liquid such as hydrofluoroether (HFE),perfluorinated polyether (PFPE), and Fomblin® oil. Moreover, the liquidLQ may be various fluids, such as, for example, supercritical liquid.

Moreover, in each of the above-described embodiments, the substrate Pincludes a semiconductor wafer for manufacturing a semiconductor device.However, for example, the substrate may include a glass substrate for adisplay device, a ceramic wafer for a thin film magnetic head, a mask oran original plate (synthetic quartz, silicon wafer) of a reticle whichis used in an exposure apparatus, or the like.

Moreover, in each of the above-described embodiments, the exposureapparatus EX is a scanning type exposure apparatus (scanning stepper) ofa step-and-scan system in which the mask M and the substrate Psynchronously move and the patterns of the mask M are scanned andexposed. However, for example, the exposure apparatus may be aprojection exposure apparatus (stepper) of a step-and-repeat system inwhich patterns of the mask M are collectively exposed in a state wherethe mask M and the substrate P are stationary and the substrate P issequentially step-moved.

In addition, the exposure apparatus EX may be an exposure apparatus (acollective exposure apparatus of a stitch system) in which, in theexposure of a step-and-repeat system, after the reduced image of a firstpattern is transferred on the substrate P using the projection opticalsystem in a state where the first pattern and the substrate P aresubstantially stationary, the reduced image of a second pattern ispartially overlapped with the first pattern using the projection opticalsystem and is collectively exposed on the substrate P in a state wherethe second pattern and the substrate P are substantially stationary.Moreover, the exposure apparatus of the stitch system may be an exposureapparatus of a step-and-stitch system in which at least two patterns arepartially overlapped on the substrate P and transferred thereto, and thesubstrate P is sequentially moved.

In addition, for example, the exposure apparatus EX may be an exposureapparatus in which patterns of two masks are combined on the substratevia the projection optical system and one shot region on the substrateis approximately simultaneously double-exposed by single scanningexposure, as disclosed in U.S. Pat. No. 6,611,316. Moreover, theexposure apparatus EX may be an exposure apparatus of a proximitysystem, a mirror projection aligner, or the like.

In addition, in each of the above-described embodiments, the exposureapparatus EX may be an exposure apparatus of a twin stage type whichincludes a plurality of substrate stages, as disclosed in U.S. Pat. No.6,341,007, U.S. Pat. No. 6,208,407, U.S. Pat. No. 6,262,796, or thelike. For example, as shown in FIG. 30, when the exposure apparatus EXincludes two substrate stages 2001 and 2002, the object which is able tobe arranged so as to be opposite to the emitting surface 12 includes atleast one of one substrate stage, a substrate which is held by a firstholding portion of the one substrate stage, another substrate stage, anda substrate which is held by a first holding portion of anothersubstrate stage.

Moreover, the exposure apparatus EX may be an exposure apparatus whichincludes the plurality of substrate stages and measurement stages.

The exposure apparatus EX may be an exposure apparatus for manufacturinga semiconductor element which exposes a semiconductor element pattern onthe substrate P, an exposure apparatus for manufacturing a liquidcrystal display element or a display, or an exposure apparatus formanufacturing a thin film magnetic head, an imaging element (CCD), amicromachine, a MEMS, a DNA chip, or a reticle or mask, or the like.

Moreover, in each of the above-described embodiments, the lighttransmission type mask is used in which a predetermined light shieldingpattern (or a phase pattern, a dimming pattern) is formed on thesubstrate having light transparency. However, instead of this mask, forexample, as disclosed in U.S. Pat. No. 6,778,257, a variable moldingmask (also referred to as an electronic mask, an active mask, or animage generator) may be used which forms a transparent pattern, areflective pattern, or a light-emitting pattern based on electronic dataof the pattern to be exposed. In addition, instead of the variablemolding masks which include a non-light emission type image displayelement, a pattern-forming apparatus which includes a selflight-emission type image display element may be provided.

In each of the above-described embodiments, the exposure apparatus EXincludes the projection optical system PL. However, the components ineach of the above-described embodiments may be applied to an exposureapparatus and an exposing method which do not use the projection opticalsystem PL. For example, the components in each of the above-describedembodiments may be applied to an exposure apparatus and an exposingmethod in which the liquid immersion space is formed between an opticalmember such as a lens and the substrate and the exposure light isradiated to the substrate via the optical member.

Moreover, for example, the exposure apparatus EX may be an exposureapparatus (a lithography system) in which interference fringes areformed on the substrate P, and thus, a line-and-space pattern is exposedon the substrate P, as disclosed in PCT International Publication No. WO2001/035168.

The exposure apparatuses EX of the above-described embodiments aremanufactured by assembling various subsystems including eachabove-described component so as to maintain predetermined mechanicalaccuracy, electrical accuracy, and optical accuracy. In order to securethe various accuracies, before and after the assembly, adjustment forachieving optical accuracy with respect to various optical systems,adjustment for achieving mechanical accuracy with respect to variousmechanical systems, and adjustment for achieving electrical accuracywith respect to various electrical systems are performed. The process ofassembling the exposure apparatus from various subsystems includesmechanical connections, wiring connections of electric circuits, pipingconnections of air-pressure circuits, or the like between varioussubsystems. Of course, the respective assembly processes of eachsubsystem are needed before the assembly process from various subsystemsto the exposure apparatus. After the assembly process of the exposureapparatus by various subsystems is terminated, a general adjustment isperformed, and thus, various accuracies in the overall exposureapparatus are secured. Moreover, it is preferable that the manufacturingof the exposure apparatus be performed in a clean room in which atemperature, a degree of cleanness, or the like is controlled.

As shown in FIG. 31, a micro-device such as a semiconductor device ismanufactured through a step 201 in which the function and performancedesign of the micro-device is performed, a step 202 in which a mask(reticle) is manufactured based on the design step, a step 203 in whicha substrate which is a base material of the device is manufactured, asubstrate processing step 204 which includes the substrate processing(exposure processing) including exposing the substrate by the exposurelight from the pattern of the mask and developing the exposed substrateaccording to the above-described embodiments, a device assembly step(which includes manufacturing processes such as a dicing process, abonding process, and a package process) 205, an inspection step 206, orthe like.

Moreover, the aspects of each embodiment described above may beappropriately combined. In addition, some components may not be used.Moreover, as long as legally permitted, the disclosures of allpublications and United States Patents with respect to the exposureapparatuses or the like cited in each of the above-mentioned embodimentand modifications are incorporated in the disclosures of the presentapplication.

1. An exposure apparatus in which a substrate is exposed to exposurelight via liquid between an optical member and the substrate, theexposure apparatus comprising: a reference frame; an optical systemincluding the optical member, which is supported by the reference frame;a liquid immersion member that is configured to form an immersion liquidspace and that includes a first member disposed to surround a path ofthe exposure light and a second member disposed to surround the path ofthe exposure light, the first member having a first opening via whichthe exposure light is projected and a first lower surface disposedaround the first opening, the second member having a second opening viawhich the exposure light is projected and a second lower surfacedisposed around the second opening, and the first lower surface beingdisposed between the path of the exposure light and the second lowersurface; a driving apparatus configured to relatively move the secondmember with respect to the first member, the second member being movableby the driving apparatus in a direction substantially perpendicular toan optical axis of the optical member in order to decrease a relativespeed between the second member and the substrate; and a vibrationisolator by which the reference member is isolated from vibrationscaused by the movement of the second member.